Industry News
Electronics industry updates from leading sources
EmbeddedOct 30, 2026
Development Platforms for Edge AI, When Engineering Apps Need Agentic AI, Real-Time Sensing: Embedded Week Insights
EmbeddedOct 30, 2026
Altera Brings FPGAs to Physical AI With Agilex 2X and an Agentic Design Assistant
Power Electronics NewsOct 30, 2026
Advanced Energy Expands M-CRPS Range for AI Data Centers
Power Electronics NewsOct 30, 2026
Wafer-Level Burn-In Improves WBG Device Reliability, Automotive and Aerospace WBG Device Testing, Direct Dielectric Cooling for Power Converters: Power Electronics Week Insights
Power Electronics NewsOct 30, 2026
SemiQ Launches 750 V and 1200 V Gen4 SiC MOSFETs
Power Electronics NewsOct 30, 2026
Wide Bandgap Monthly Insights – October 2026
ELE TimesOct 30, 2026
N.A.N. Enaex Invests ₹750 Crore in India’s Explosives Market, Targets $300 Million Revenue
Semiconductor EngineeringOct 30, 2026
Chip Industry Week In Review
EmbeddedOct 29, 2026
Ceva Expands NeuPro NPU Portfolio into AI Infrastructure
Semiconductor DigestOct 29, 2026
Entrepix Introduces Head360 CMP Head Rebuild Services
Semiconductor DigestOct 29, 2026
TANAKA and MEP to Establish Precious Metal Refining Joint Venture in Malaysia
Semiconductor DigestOct 29, 2026
Sanjay Mehrotra, Chairman and CEO at Micron Technology, to Receive Global Semiconductor Alliance’s Highest Honor
Semiconductor DigestOct 29, 2026
Nagare Labs Emerges from Stealth to Break AI’s Memory Bottleneck
EmbeddedOct 29, 2026
Celus Adds Agentic AI Workflow to Its Electronics Design Assistant
Power Electronics NewsOct 29, 2026
Infineon Advances GaN Power for 800 VDC AI Data Centers
ELE TimesOct 29, 2026
OfficeNet Launches Smart Factory Platform to Streamline Workforce Management
Power Electronics NewsOct 29, 2026
Power Corner: Testing Data Center Sidecars with Regenerative Loads
ELE TimesOct 29, 2026
Renesas Launches Ultra-Low-Power RL78/G21 MCU for Smart Appliance Control
ELE TimesOct 29, 2026
DigiKey Adds 27,000 New Stocking Products and 93 Suppliers in Q3 2026
Semiconductor EngineeringOct 29, 2026
Auto-Generation Of Properties: Methodology Insertion
Semiconductor EngineeringOct 29, 2026
Rethinking Shift Left In Chip Design
Semiconductor EngineeringOct 29, 2026
AI Raises The Bar For Tomorrow’s Engineers
Semiconductor EngineeringOct 29, 2026
The Complexity Between The Bits
Semiconductor EngineeringOct 29, 2026
Is It Getting Hot In Here? Why Thermal Is No Longer A Signoff Problem
Semiconductor EngineeringOct 29, 2026
Physics-Based Validation: The Foundation Of Trustworthy Agentic EDA
Semiconductor EngineeringOct 29, 2026
The EU Cyber Resilience Act Reaches Chip And IP Suppliers
Semiconductor EngineeringOct 29, 2026
From Functional Monitoring To In-System Test: Extending Voltage-Aware Observability
Semiconductor EngineeringOct 29, 2026
Scaling Autonomous Root Cause Analysis For Regression Triage
Semiconductor EngineeringOct 29, 2026
Why Physics Needs To Move At The Pace Of Design
ELE TimesOct 29, 2026
Emerson Expands NI PXI Platform With New Instruments for AI-Accelerated Automated Testing
EmbeddedOct 28, 2026
Qt Group Introduces Clate for AI-Powered Embedded UX Design
Semiconductor DigestOct 28, 2026
ChipAgents Expands Full-Stack Agentic AI Across Digital and Analog Chip Design
Semiconductor DigestOct 28, 2026
Lam and imec Expand Collaboration to Advance Manufacturability of Next-Gen 3D Integration Technologies
Semiconductor DigestOct 28, 2026
SEMI Scales Up Workforce Programs as U.S. Talent Gap Nears 200,000
EmbeddedOct 28, 2026
When Engineering Apps Need Agentic AI
Power Electronics NewsOct 28, 2026
Enphase, Infineon Develop 900 V GaN Bidirectional Switches
Power Electronics NewsOct 28, 2026
Vertical Semiconductor Targets $73M in CHIPS Funding for GaN
Power Electronics NewsOct 28, 2026
Wafer-Level Burn-In for Improved WBG Device Reliability
ELE TimesOct 28, 2026
Microchip Achieves Key Milestones in PIC64-HPSC Spaceflight Computing Development
Semiconductor DigestOct 28, 2026
From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing
Semiconductor DigestOct 28, 2026
Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography
Semiconductor DigestOct 28, 2026
Advanced Packaging Process Control Through Full-Field Wafer Shape Using WFPI
ELE TimesOct 28, 2026
“We’re Redefining Vehicular Security in Software Defined Vehicles” — R.V. Raghu, Director, Versatilist Consulting India
Semiconductor EngineeringOct 28, 2026
Introducing Build-A-Chip-Bench: From Workload Specification to GDS
Semiconductor EngineeringOct 28, 2026
Foundations of Power Management in the Age of AI
Semiconductor EngineeringOct 28, 2026
Using AI for Analog Design
Semiconductor EngineeringOct 28, 2026
Foundation IP For The AI Era: Why Execution Saves You Millions On HPC And Edge AI SoCs
Semiconductor EngineeringOct 28, 2026
Planning Your AI Design Journey In RF EDA
Semiconductor EngineeringOct 28, 2026
How Much Can Semiconductor Models Hide?
Semiconductor EngineeringOct 28, 2026
Blog Review: Oct. 28
ELE TimesOct 28, 2026
Infineon to Build Europe’s First High-Volume 300mm GaN Power Semiconductor Manufacturing Facility
EmbeddedOct 27, 2026
Seco Unveils Clea 2.0 Agentic Framework for Edge AI Applications
Semiconductor EngineeringOct 27, 2026
Analog Superposition Increases Effective PCM Storage Density (IBM Research Europe)
Semiconductor DigestOct 27, 2026
AMHS Is Not Just Factory Logistics
EmbeddedOct 27, 2026
Building More with Less: How to Navigate the Memory Chip Shortage
Semiconductor DigestOct 27, 2026
Wafer Fab Equipment: A Booming Market Built on a Fragmenting Supply Chain
Semiconductor DigestOct 27, 2026
Back-End Equipment: From Volume Assembly to a Strategic Advanced Packaging Ecosystem
Semiconductor DigestOct 27, 2026
From Wafers to Panels: Overcoming Lithography Challenges in Advanced Packaging
Semiconductor DigestOct 27, 2026
Has AI Shifted the Sustainability Balance from Chip Design to Manufacturing?
Semiconductor DigestOct 27, 2026
Why Is AI Finally Sticking Inside the Fab?
Semiconductor DigestOct 27, 2026
The Measurement Gap: Why Metrology and Inspection Is Outgrowing the Industry’s Ability to Supply It
Semiconductor DigestOct 27, 2026
Why SiC and GaN Need Their Own Qualification Standards
Semiconductor DigestOct 27, 2026
How to Tackle Hidden Production Risks in Semiconductor Operations
Power Electronics NewsOct 27, 2026
Murata Develops World’s Smallest 008004-Inch NTC Thermistor
ELE TimesOct 27, 2026
Powering India’s Growth: Key Companies in the Electrical Infrastructure Value Chain
ELE TimesOct 27, 2026
Rohde & Schwarz to Showcase Advanced Test and Measurement Solutions at electronica 2026
Power Electronics NewsOct 27, 2026
Direct Dielectric Cooling for Power Converters
ELE TimesOct 27, 2026
Cadence Introduces Maestro AI Models to Accelerate Chip Design with Up to 5X Greater Token Efficiency
ELE TimesOct 27, 2026
AI Agent Orchestration Explained: How Frameworks, Memory, Tools and Governance Work Together
Semiconductor EngineeringOct 27, 2026
The imec Report: Scaling Optical Interconnects For The AI Era
Semiconductor EngineeringOct 27, 2026
Chip Industry Technical Paper Roundup: Oct. 27
EmbeddedOct 26, 2026
Cadence Launches Maestro AI Models for Chip and System Design
Semiconductor DigestOct 26, 2026
Silicon Carbide and Gallium Nitride Play Growing Role in Electronics Design, Manufacturing and Supply-Chain Strategy
Semiconductor DigestOct 26, 2026
Cadence Unveils Domain-Specialized Maestro AI Models for Chip Design
Power Electronics NewsOct 26, 2026
Flex Completes EPC Power Acquisition
Power Electronics NewsOct 26, 2026
EMI Guidance for Power Converters, FinFET-Based Power Devices, Simulation-Driven Thermal Modeling for SiC and GaN Converters: Power Electronics Week Insights
Power Electronics NewsOct 26, 2026
Toshiba Unveils eFuse ICs for 1.8V Power Line Protection
Semiconductor DigestOct 26, 2026
From Fluid Handling to Dose Control: How Valve Technology Evolved from Process Component to Dose-Control Enabler
Semiconductor DigestOct 26, 2026
The High-Tech Workforce Has Changed, and Employers Need to Change With It
Semiconductor DigestOct 26, 2026
Taking a Holistic Approach to Co-Packaged Optics Manufacturing
Semiconductor DigestOct 26, 2026
Machine Learning Could Make Gas Purity Data Do More Than Pass or Fail
Semiconductor DigestOct 26, 2026
Chemical-Resistant Coatings: A Critical Defense for Semiconductor Fabs
Semiconductor DigestOct 26, 2026
Spotfire Puts AI Inside the Analysis for Yield Engineers
Semiconductor DigestOct 26, 2026
SEMI Builds a Global Home for Advanced Packaging
Semiconductor DigestOct 26, 2026
Semiconductor Sustainability Needs a Whole-Fab View, Not a Point-of-Use Fix
Semiconductor DigestOct 26, 2026
Edwards’ Genesee Facility Enters Production, Bringing Dry Pump Manufacturing to the U.S.
Semiconductor DigestOct 26, 2026
More Pumping Speed, Same Footprint: Edwards Previews Its Next-Gen Turbopumps
Semiconductor DigestOct 26, 2026
Optical Stability Is Becoming a Process-Control Issue
EmbeddedOct 26, 2026
Streamlined Development Platforms Are Now Critical to Edge AI Deployment
ELE TimesOct 26, 2026
Centralised Computing Architectures Are Replacing Traditional ECU-Based Designs: Robert Schweiger, Cadence
Power Electronics NewsOct 26, 2026
Automotive and Aerospace Wide-Bandgap Device Testing
ELE TimesOct 26, 2026
dSPACE India 2026 Conference Highlights AI, ECU Cybersecurity and HIL Testing
ELE TimesOct 26, 2026
DRDO Successfully Tests Indigenous High-Altitude Surveillance Platform
ELE TimesOct 26, 2026
BAE Systems Unveils High-Power Microwave and Advanced Artillery Defence Systems
ELE TimesOct 26, 2026
Raytheon Advances Coyote Interceptor to Counter Emerging Drone Threats
ELE TimesOct 26, 2026
Leonardo DRS Launches Digital Radar for Air and Missile Defence
ELE TimesOct 26, 2026
Indian Army to Receive Rs 770 Crore Advanced Radar Systems
Semiconductor EngineeringOct 26, 2026
Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)
Semiconductor EngineeringOct 26, 2026
Large-Format Masks Move From Aspiration To Industry Roadmap
Semiconductor EngineeringOct 26, 2026
Testing Silicon Photonics At Scale
News articles are republished from industry sources for reference. All rights belong to the original publishers.