Industry News
Electronics industry updates from leading sources
Power Electronics NewsSep 16, 2026
PowerUP Circuit Lab: How to Build a Complete PoE-Powered-Device Chain to Isolated 12V
Semiconductor EngineeringSep 16, 2026
Moving Test Data Faster
Semiconductor EngineeringSep 16, 2026
Why SoC Interconnects Have Outgrown the Bus
Semiconductor EngineeringSep 16, 2026
The Missing Science Of Robotic Systems
Semiconductor EngineeringSep 16, 2026
System-level Power Integrity Analysis Using The Innovator 3D IC Solution Suite
Semiconductor EngineeringSep 16, 2026
Enhancing AI Inference Efficiency with Cadence LPDDR Memory IP Solutions
Semiconductor EngineeringSep 16, 2026
Enabling Efficient Edge AI Inferencing Through Ecosystem Collaboration
Semiconductor EngineeringSep 16, 2026
Blog Review: Sept. 16
Semiconductor DigestSep 15, 2026
Gradiant Wins New Water Contracts for Major US Semiconductor Fabs in New York, Virginia, Idaho, and Utah
Semiconductor DigestSep 15, 2026
Aeluma Executes Strategic Agreement with Sumitomo Chemical Advanced Technologies
Semiconductor DigestSep 15, 2026
TeRAM Emerges from Stealth with $37M to Develop 3D SRAM for AI Systems
Semiconductor DigestSep 15, 2026
MediaTek Launches Dimensity 9600 Pro on TSMC 2nm Process
EmbeddedSep 15, 2026
Tektronix Launches Dynamic Test System for 800-V AI Data Centers
EmbeddedSep 15, 2026
MediaTek Unveils New Flagship Smartphone Chip
EmbeddedSep 15, 2026
ESD eBook September/October 2026: Rethinking Mil/Aero System Design
Power Electronics NewsSep 15, 2026
TDK Launches 12.5kW Three-Phase Power Supplies
Power Electronics NewsSep 15, 2026
Understanding PCS Architectures for Utility-Scale BESSes
ELE TimesSep 15, 2026
INFAC Develops 800V-to-48V Power Conversion Technology to Targets Higher EV Efficiency
Semiconductor EngineeringSep 15, 2026
AI Data Centers Have A Stranded Power Problem
Semiconductor EngineeringSep 15, 2026
Hardware-Software Co-Design In The AI Era
Semiconductor EngineeringSep 15, 2026
Scaling Thermal Analysis From Transistors To Data Centers
Semiconductor EngineeringSep 15, 2026
Scaling AI Infrastructure With PCIe Switches And Retimers
Semiconductor EngineeringSep 15, 2026
AMBA Over UCIe: Building Coherent Multi-Die Systems
Semiconductor EngineeringSep 15, 2026
Compressing An 11B VLM To 2.7-bit Weights For Mobile CPUs
Semiconductor EngineeringSep 15, 2026
Validating PCIe 6.0 Connectivity In A 3D Multi-Die Test Chip
Semiconductor EngineeringSep 15, 2026
One Processor, One Toolchain
Semiconductor DigestSep 14, 2026
Omdia: Global Semiconductor Revenue Surges 31% to Record $425B in 2Q26
Semiconductor DigestSep 14, 2026
MIRTEC to Showcase Cutting-Edge 3D Semiconductor Inspection System at SEMICON West 2026
Semiconductor DigestSep 14, 2026
The NY Creates and Micron Technology Joint Apprenticeship Program Welcomes First Cohort
EmbeddedSep 14, 2026
Eggtronic, Renesas Target 140-W USB-C Chargers with GaN
Semiconductor DigestSep 14, 2026
Hardware Assisted Verification Is Key to AI Chip Design
Semiconductor DigestSep 14, 2026
When Firmware Panics Expose Semiconductor Defects
Semiconductor DigestSep 14, 2026
ALD System Design is the Key to Proper Precursor Gas Delivery
Semiconductor DigestSep 14, 2026
Precision Under Pressure: Ensuring Quality in a Globalized and Miniaturized Semiconductor Industry
Power Electronics NewsSep 14, 2026
Vishay Introduces High-Density Bidirectional TVS Protection
EmbeddedSep 14, 2026
Designing SWaP-Optimized Compute for UAVs
Power Electronics NewsSep 14, 2026
ST Unveils L4983 PFC Controller for kW Power Supplies
ELE TimesSep 14, 2026
Why India Needs Smarter and More Standardised EV Charging Infrastructure
ELE TimesSep 14, 2026
Rare-Earth-Free EV Motors: How India Could Reduce Dependence on Critical Magnet Materials
ELE TimesSep 14, 2026
India Tightens EV Localisation Rules, Putting Traction Motor Technology in Focus
ELE TimesSep 14, 2026
Indian Army Launches AASHVAST Lab to Detect Chinese Components and Cyber Threats
ELE TimesSep 14, 2026
AeroVironment Receives First International Order for LOCUST Laser System
ELE TimesSep 14, 2026
Covenant Introduces a Mass-Produced Cruise Missile Called Anthem
ELE TimesSep 14, 2026
The DRDO’s SHIELD Programme Focused on Microwave & Drone-Electronics Testing
Power Electronics NewsSep 14, 2026
The Critical Role of Power Conversion in the Hydrogen Economy
ELE TimesSep 14, 2026
1.10 Lakh Crore Indian Defence Technology Pipeline Approved
ELE TimesSep 14, 2026
India Will Open AI Labs for Sri Lankan Army
Semiconductor EngineeringSep 14, 2026
Advanced Packaging Changes The Rules For Semiconductor Health And Performance Management
Semiconductor EngineeringSep 14, 2026
Chip Industry Technical Paper Roundup: Sept. 14
Semiconductor EngineeringSep 11, 2026
Heterogeneous Memory Chiplets Accelerate Multi-Request LLM Inference (NUS)
Semiconductor EngineeringSep 11, 2026
Reducing HBM ECC Controller Overhead For AI Inference (RPI, IBM)
Semiconductor EngineeringSep 11, 2026
Molybdenum Quasi Phase-Only Masks Improve EUV Imaging (NYCU, TSMC)
Semiconductor EngineeringSep 11, 2026
Characterizing Charge Components In TMD-based MOS Structures (imec, KU Leuven, ASM)
Semiconductor EngineeringSep 11, 2026
Modeling Predicts Cure And Thermal Endurance Of Advanced Packaging Underfill (NIST, UCSD et al.)
Semiconductor EngineeringSep 11, 2026
HW Information-Flow Tracking for Pre-Silicon Security Testing (Princeton, MIT, EPFL)
Semiconductor DigestSep 11, 2026
Xanadu, ASML to Advance Lithography for Photonic Quantum Hardware
EmbeddedSep 11, 2026
Processors and Chiplet-Based FPGAs for Mission-Critical Systems, Scalable Physical AI Solutions: Embedded Week Insights
Semiconductor DigestSep 11, 2026
Synopsys and A*STAR IME Join Forces to Accelerate Innovation for Advanced Semiconductor Packaging
Semiconductor DigestSep 11, 2026
National Network for Microelectronics Education Announces Inaugural Industry Advisory Committee to Help Shape America’s Semiconductor Workforce Strategy
Semiconductor DigestSep 11, 2026
Synopsys Joins Arm Total Design for Physical AI to Advance Autonomous Systems
Semiconductor DigestSep 11, 2026
Kyocera and Tohoku University Develop Technology to Integrate Optical Isolators Directly onto Silicon Photonics Chips
Semiconductor DigestSep 11, 2026
Positron AI Raises $875 Million at a $5 Billion Valuation to Bring Its Next-Generation Inference Silicon to Market
Power Electronics NewsSep 11, 2026
Multiaxial Coreless Current Sensing, Improved GaN HEMT SEE Radiation Hardness, Measurement Hardware for Grid Digital Twins: Power Electronics Week Insights
EmbeddedSep 11, 2026
Renesas Launches 64-Bit MPUs for HMI and IoT Edge
Power Electronics NewsSep 11, 2026
Microchip Introduces 1.2V LVCMOS Clock Buffers
ELE TimesSep 11, 2026
PRAMA Showcases Smart Security Solutions for MSMEs at Bharatiya Vyapar Mahotsav 2026
ELE TimesSep 11, 2026
GSAS Micro Systems Expands Manufacturing and R&D Operations with New Doddaballapur Facility
Semiconductor EngineeringSep 11, 2026
Chip Industry Week in Review
ELE TimesSep 11, 2026
Mr. Sandeep Rao as an Advisor to Tirupati Forge Ltd.: From Indian Army Artillery to Defence Industry
ELE TimesSep 11, 2026
Microchip and Marelli Develop Open-Standard Display Connectivity Solution for Software-Defined Vehicles
ELE TimesSep 11, 2026
Rohde & Schwarz Showcases Advanced RF and Microwave Test Solutions at EuMW 2026 in London
Semiconductor DigestSep 10, 2026
eBeam Initiative Survey of Semiconductor Luminaries Predicts a Bright Outlook for the Photomask Industry
EmbeddedSep 10, 2026
Alif Semiconductor Launches $49 StartKits for Edge AI MCUs
Semiconductor DigestSep 10, 2026
NY Creates Announces Participation in 12-Inch Mask Industry Initiative to Advance High NA EUV Lithography Ecosystem
Semiconductor DigestSep 10, 2026
Samsung Electro-Mechanics Showcases Next-Generation Semiconductor Package Substrate Technologies for AI and Servers at ‘KPCA Show 2026’
Semiconductor DigestSep 10, 2026
Analog Devices to Acquire Alif Semiconductor
Semiconductor DigestSep 10, 2026
Taiyo Holdings Launches Next-Generation Semiconductor Packaging Material “FPIM Series”
EmbeddedSep 10, 2026
Chiplet-Based FPGAs Optimize Performance for Space Applications
Power Electronics NewsSep 10, 2026
Knowles Introduces CLS Flatpack Aluminum Electrolytic Capacitors
Power Electronics NewsSep 10, 2026
Inside TI’s Multiaxial Approach to Coreless Current Sensing
ELE TimesSep 10, 2026
Infineon and SolarEdge Expand Collaboration for Solid-State Protection in 800 VDC AI Data Centres
Power Electronics NewsSep 10, 2026
STMicroelectronics Introduces L9962 Battery-Management IC
ELE TimesSep 10, 2026
GOPEL Electronic to Showcase New AOI, BScan and X-ray Inspection Systems at Electronica 2026
ELE TimesSep 10, 2026
Arrow Electronics Provides Remote Assessment of NXP’s Ara240 Edge AI Accelerator
ELE TimesSep 10, 2026
Rust MEMS Drivers: 3 Reasons to Try and Adopt New Sensor Drivers Written in Rust
Semiconductor EngineeringSep 10, 2026
Redefining Processes At Sub-2nm
Semiconductor EngineeringSep 10, 2026
Silent Data Errors Redefine Test Coverage And Fleet Maintenance Strategies
Semiconductor EngineeringSep 10, 2026
Validation Gets Tested At 1kW
Semiconductor EngineeringSep 10, 2026
Beyond Thickness: Using Picosecond Ultrasonic Technology For SiCr Process Control In BCD Devices
Semiconductor EngineeringSep 10, 2026
Beyond Conventional Ring Oscillators: Purpose-Built Process Detectors For Deeper Silicon Insight
Semiconductor EngineeringSep 10, 2026
System-Level Test In The AI Era: Validating Reliability At Scale
Semiconductor EngineeringSep 10, 2026
Accelerating Shift Left With Early RTL DFT Analysis And Connectivity Verification
Semiconductor EngineeringSep 10, 2026
From Silicon To Systems: Redefining Competitive Advantage, Part 2
Semiconductor EngineeringSep 10, 2026
Rethinking Verification Traceability for Modern Systems
Semiconductor EngineeringSep 10, 2026
A Highly Scalable Architecture For AI-First Semiconductor Operations
Semiconductor DigestSep 9, 2026
Quantinuum Finalizes $100 Million CHIPS R&D Award with U.S. Department of Commerce
Semiconductor DigestSep 9, 2026
SEMI Calls on the Chips Act 2.0 to Strengthen Semiconductor Competitiveness and Resilience
Semiconductor DigestSep 9, 2026
ASML Begins Construction of New Eindhoven Campus
EmbeddedSep 9, 2026
Morse Micro Introduces Wi-Fi HaLow USB Network Adapters
EmbeddedSep 9, 2026
Neura Robotics and Seco Partner to Scale Physical AI
News articles are republished from industry sources for reference. All rights belong to the original publishers.