Chip Industry Technical Paper Roundup: Sept. 14

New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper	Research Organizations
CHIPSMORE: Compute-in-Interconnect and -Memory Chiplets for Multi-Mode Multi-Request LLM Inference Acceleration	National University of Singapore
REACH: Controller-Managed Long-Span ECC for HBM AI Inference	RPI, IBM T. J. Watson Research Center
High contrast EUV imaging enabled by topological quasi phase-only masks	NYCU, TSMC
Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging	NIST, UC San Diego, et al.
Efficient Hardware Information-Flow Tracking for Pre-Silicon Security Testing	Princeton University, MIT CSAIL, EPFL
Dissecting the transition metal dichalcogenides-based metal-oxide-semiconductor structures charge components	imec, KU Leuven, ASM

Find more semiconductor research papers here.