MediaTek Unveils New Flagship Smartphone Chip

MediaTek has launched its latest flagship smartphone SoC, the Dimensity 9600 Pro, built on the TSMC's advanced 2-nm process node and a new native AI architecture. The Dimensity 9600 Pro claims a leap in performance and efficiency, including a 61% reduction in multi-core power consumption. The smartphone chip is built for agentic AI, gaming, imaging, and compute.

Here are the specs. The Dimensity 9600 Pro features a 2+3+3 All Big Core CPU design for faster and more responsive experiences while reducing multi-core power consumption by 61%, according to MediaTek. The architecture comprises two C2-Ultra cores with clock speeds up to 4.55 GHz, three C2-Pro big cores at 4.35 GHz, and three C2-Pro big cores at 3.1GHz. It offers up to 17% higher single-core performance and up to 15% higher multi-core performance compared to the previous generation.

The Dimensity 9600 Pro also features a dual-NPU architecture and an agentic AI engine for on-device AI. The second-generation Super Efficient NPU reduces power consumption by 40% for always-on AI, while the NPU 1090 delivers 51% higher large language model (LLM) prefill performance, and 55% higher token generation per watt. It supports complex on-device applications, including models up to 30B parameters. The agentic AI engine delivers capabilities such as smart analysis of on-device data, proactive assistance, and personalized responses that learn your preferences.

Other features include larger 34.5-MB cache and, for the first time, LPDDR6 memory and UFS 5.0 storage to support the AI computing fusion architecture, MediaTek said. The company also upgraded the Dimensity Scheduling Engine to coordinate hardware and software to allocate computing, power, and memory resources.

For improved gaming, the smartphone SoC integrates the G2-Ultra NX GPU, which claims up to 27% higher peak performance, 24% lower power consumption at peak performance, and 18% faster raytracing, for higher console-grade gaming on-device at up to 185 fps. The SoC also incorporates the new MediaTek Dimensity Neural Graphics Architecture that combines GPU and AI computing, along with the MediaTek HyperEngine.

Offering higher imaging quality, the Dimensity 9600 Pro features the Imagiq 1290 ISP and new Dimensity AI Imaging Fusion Architecture that combines ISP and NPU capabilities to deliver advanced computational photography and content creation. It supports NPU-powered 60-fps motion capture and introduces 4K240 native direct-output ultra-slow-motion video to the Dimensity platform. Other features include 4K60 AI True Color Tone, 4K120 cinematic log, and 17EV imaging.

The Dimensity 9600 Pro also features an AI-powered wireless connectivity upgrade. This includes a 5G-Advanced modem for in-modem AI, Dimensity AI Smart Satellite Selection 2.0 with a new GNSS RF that improves power efficiency by up to a 65%, along with the MediaTek Connectivity AI Framework for Wi-Fi and Bluetooth.

MediaTek also announced the Dimensity 9600M SoC that brings flagship-level performance and power efficiency to more users. It uses the latest Agentic AI Engine and Dimensity Scheduling Engine for improved response and power efficiency and the MediaTek HyperEngine for gameplay up to 185 fps. The NPU delivers advanced on-device AI and the ISP offers professional-quality imaging and real-time tracking.

MediaTek expects the first smartphones with the MediaTek Dimensity 9600 Pro and Dimensity 9600M SoCs will be available this quarter.

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