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Choosing the right MLCC
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2,528,520 parts available to quote.
380LX682M016H012
CAP ALUM 6800UF 20% 16V SNAP
EDH108M050S9TAA
CAP ALUM 1000UF 20% 50V SMD
EGPA250ELL222MU25S
CAP ALUM 2200UF 20% 25V RADIAL
B41231C4189M000
CAP ALUM 18000UF 20% 16V SNAP
AFK337M25F24VT-F
CAP ALUM 330UF 20% 25V SMD
MAL213638331E3
CAP ALUM 330UF 20% 63V RADIAL
25TRV1500M16X16.5
CAP ALUM 1500UF 20% 25V SMD
UBT2G330MHD8TN
CAP ALUM 33UF 20% 400V RADIAL
380LQ123M016H022
CAP ALUM 12000UF 20% 16V SNAP
50USC2700MEFCSN20X30
CAP ALUM 2700UF 20% 50V SNAP
380LX221M200H012
CAP ALUM 220UF 20% 200V SNAP
338TMA025M
CAP ALUM 3300UF 20% 25V AXIAL
AFK477M06F24VT-F
CAP ALUM 470UF 20% 6.3V SMD
MAL213639151E3
CAP ALUM 150UF 20% 100V RADIAL
UPA1C392MHD
CAP ALUM 3900UF 20% 16V RADIAL
UCY2V680MHD6
CAP ALUM 68UF 20% 350V RADIAL
380LX681M100H012
CAP ALUM 680UF 20% 100V SNAP
MAL204830222E3
CAP ALUM 2200UF 20% 35V RADIAL
380LX562M025H012
CAP ALUM 5600UF 20% 25V SNAP
ESMG160ELL682MLN3S
CAP ALUM 6800UF 20% 16V RADIAL
AFK477M10F24VT-F
CAP ALUM 470UF 20% 10V SMD
MAL215050152E3
CAP ALUM 1500UF 20% 35V RADIAL
UPA0J822MHD
CAP ALUM 8200UF 20% 6.3V RADIAL
LLS2C391MELZ
CAP ALUM 390UF 20% 160V SNAP
381LX153M010H012
CAP ALUM 15000UF 20% 10V SNAP
MAL204834682E3
CAP ALUM 6800UF 20% 10V RADIAL
381LX102M063H012
CAP ALUM 1000UF 20% 63V SNAP
URZ2C151MHD
CAP ALUM 150UF 20% 160V RADIAL
AFK477M16F24VT-F
CAP ALUM 470UF 20% 16V SMD
MAL215055332E3
CAP ALUM 3300UF 20% 16V RADIAL
SLPX471M180A3P3
CAP ALUM 470UF 20% 180V SNAP
63ZL1000MEFC16X35.5
CAP ALUM 1000UF 20% 63V RADIAL
381LX562M025H012
CAP ALUM 5600UF 20% 25V SNAP
MAL204835472E3
CAP ALUM 4700UF 20% 16V RADIAL
381LX151M200H012
CAP ALUM 150UF 20% 200V SNAP
337BPA050M
CAP ALUM 330UF 20% 50V AXIAL
AFK687M10F24VT-F
CAP ALUM 680UF 20% 10V SMD
MAL215058681E3
CAP ALUM 680UF 20% 63V RADIAL
SLP153M016A7P3
CAP ALUM 15000UF 20% 16V SNAP
63ZL1000MEFCGC16X35.5
CAP ALUM 1000UF 20% 63V RADIAL
UBT2E470MHD
CAP ALUM 47UF 20% 250V RADIAL
MAL204836332E3
CAP ALUM 3300UF 20% 25V RADIAL
160TXW220MEFR10X60
CAP ALUM 220UF 20% 160V RAD TH
227LBA200M2CA
CAP ALUM 220UF 20% 200V SNAP
UPJ0J103MHD6
CAP ALUM 10000UF 20% 6.3V RADIAL
MAL215090105E3
CAP ALUM 1000UF 20% 35V RADIAL
SLPX182M080A3P3
CAP ALUM 1800UF 20% 80V SNAP
MAL202128221E3
CAP ALUM 220UF 20% 63V AXIAL
Industry News
Latest from electronics industry
Renesas Launches RX74M and RX74N 32-bit MCUs with 22nm Process and Embedded MRAM
Renesas Electronics Corporation has announced a pair of 32-bit MCUs that achieve up to 600 MHz processing speeds, the first MCUs in the family to utilize a 22nm process, and also designed with embedded magnetoresistive random access memory (MRAM). The first in the RX Family for Renesas using a 22nm process technology, these microcontrollers feature […] The post Renesas Launches RX74M and RX74N 32-bit MCUs with 22nm Process and Embedded MRAM appeared first on ELE Times.
Microchip Launches LX-820 Radiation-Tolerant Quartz Oscillator for LEO Satellites
Microchip Technology has expanded its L-Series timing product portfolio with the launch of the LX-820 Radiation-Tolerant Quartz Oscillator for Low Earth Orbit (LEO) satellites and other space applications. The L-Series offers satellite developers different types of oscillators with varying levels of frequency stability, phase noise, power consumption and size, allowing them to choose the right […] The post Microchip Launches LX-820 Radiation-Tolerant Quartz Oscillator for LEO Satellites ap
Chip Industry Week In Review
CHIPS Act $389M to power chips, vertical GaN, materials; Micron's memory roadmap; Nvidia expands supply chain capacity; Tenstorrent raises $1.5B; China NAND fabs; 800V power for AI data centers; Intel advances Arizona fab; China orders +$35B in Nvidia GPUs. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.
Socionext, Cadence Advance AI-Driven 3-nm SoC Design
Socionext Inc. is expanding its use of agentic artificial intelligence (AI) across system-on-chip (SoC) development, extending AI-driven workflows from front-end design and verification to the physical design of large-scale chips manufactured using advanced process technologies. The initiative includes a collaboration with Cadence Design Systems Inc. and the deployment of its InnoStack AI Super Agent for [...] The post Socionext, Cadence Advance AI-Driven 3-nm SoC Design appeared first on Embedd
Navitas Launches 2300-V SiC Power Module for Grid Infrastructure
2300 V SiC technology targets higher efficiency and power density in AI data centers, energy storage, and grid applications. The post Navitas Launches 2300-V SiC Power Module for Grid Infrastructure appeared first on Power Electronics News.
How Agentic AI Accelerates Edge AI Software Development
Deploying an AI model on edge hardware involves much more than generating application code. The model needs to be compressed or quantized to fit available memory, compiled for a specific processor, integrated with a runtime, and tested for latency, power consumption, and accuracy. Developers must also make the software work with the surrounding embedded components [...] The post How Agentic AI Accelerates Edge AI Software Development appeared first on Embedded.
Industry Blog
Component guides, sourcing tips, and buying advice
Sourcing Connectors Interconnects Without Regret: A Field Guide
The connector that fails at 3 a.m. costs more than the connector. A field guide to the parameters that matter: current derating, plating, latch types, series se
NTC Thermistor Sourcing: Lead Time Trends & Alternatives for 2026
NTC thermistor lead times are stretching again in 2026, especially automotive-grade parts. What's driving them, which specs matter, and what to qualify as a bac
What We Specify for IoT Devices: Connector and Interconnect Notes
Field notes from IoT BOM reviews: which 1.0–2.5 mm pitch connectors we pick for battery, sensor, and RF links — and which we reject.
What Actually Matters When Specifying Connectors and Interconnects
Voltage ratings distract you. Current per contact, plating thickness, and crimp tooling decide whether a connector survives production. Here's what we check fir
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