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2,528,557 parts available to quote.
380LX682M016H012
CAP ALUM 6800UF 20% 16V SNAP
EDH108M050S9TAA
CAP ALUM 1000UF 20% 50V SMD
EGPA250ELL222MU25S
CAP ALUM 2200UF 20% 25V RADIAL
B41231C4189M000
CAP ALUM 18000UF 20% 16V SNAP
AFK337M25F24VT-F
CAP ALUM 330UF 20% 25V SMD
MAL213638331E3
CAP ALUM 330UF 20% 63V RADIAL
25TRV1500M16X16.5
CAP ALUM 1500UF 20% 25V SMD
UBT2G330MHD8TN
CAP ALUM 33UF 20% 400V RADIAL
380LQ123M016H022
CAP ALUM 12000UF 20% 16V SNAP
50USC2700MEFCSN20X30
CAP ALUM 2700UF 20% 50V SNAP
380LX221M200H012
CAP ALUM 220UF 20% 200V SNAP
338TMA025M
CAP ALUM 3300UF 20% 25V AXIAL
AFK477M06F24VT-F
CAP ALUM 470UF 20% 6.3V SMD
MAL213639151E3
CAP ALUM 150UF 20% 100V RADIAL
UPA1C392MHD
CAP ALUM 3900UF 20% 16V RADIAL
UCY2V680MHD6
CAP ALUM 68UF 20% 350V RADIAL
380LX681M100H012
CAP ALUM 680UF 20% 100V SNAP
MAL204830222E3
CAP ALUM 2200UF 20% 35V RADIAL
380LX562M025H012
CAP ALUM 5600UF 20% 25V SNAP
ESMG160ELL682MLN3S
CAP ALUM 6800UF 20% 16V RADIAL
AFK477M10F24VT-F
CAP ALUM 470UF 20% 10V SMD
MAL215050152E3
CAP ALUM 1500UF 20% 35V RADIAL
UPA0J822MHD
CAP ALUM 8200UF 20% 6.3V RADIAL
LLS2C391MELZ
CAP ALUM 390UF 20% 160V SNAP
381LX153M010H012
CAP ALUM 15000UF 20% 10V SNAP
MAL204834682E3
CAP ALUM 6800UF 20% 10V RADIAL
381LX102M063H012
CAP ALUM 1000UF 20% 63V SNAP
URZ2C151MHD
CAP ALUM 150UF 20% 160V RADIAL
AFK477M16F24VT-F
CAP ALUM 470UF 20% 16V SMD
MAL215055332E3
CAP ALUM 3300UF 20% 16V RADIAL
SLPX471M180A3P3
CAP ALUM 470UF 20% 180V SNAP
63ZL1000MEFC16X35.5
CAP ALUM 1000UF 20% 63V RADIAL
381LX562M025H012
CAP ALUM 5600UF 20% 25V SNAP
MAL204835472E3
CAP ALUM 4700UF 20% 16V RADIAL
381LX151M200H012
CAP ALUM 150UF 20% 200V SNAP
337BPA050M
CAP ALUM 330UF 20% 50V AXIAL
AFK687M10F24VT-F
CAP ALUM 680UF 20% 10V SMD
MAL215058681E3
CAP ALUM 680UF 20% 63V RADIAL
SLP153M016A7P3
CAP ALUM 15000UF 20% 16V SNAP
63ZL1000MEFCGC16X35.5
CAP ALUM 1000UF 20% 63V RADIAL
UBT2E470MHD
CAP ALUM 47UF 20% 250V RADIAL
MAL204836332E3
CAP ALUM 3300UF 20% 25V RADIAL
160TXW220MEFR10X60
CAP ALUM 220UF 20% 160V RAD TH
227LBA200M2CA
CAP ALUM 220UF 20% 200V SNAP
UPJ0J103MHD6
CAP ALUM 10000UF 20% 6.3V RADIAL
MAL215090105E3
CAP ALUM 1000UF 20% 35V RADIAL
SLPX182M080A3P3
CAP ALUM 1800UF 20% 80V SNAP
MAL202128221E3
CAP ALUM 220UF 20% 63V AXIAL
Industry News
Latest from electronics industry
Pt-W Alloy Shows Potential For Thinner High-NA EUV Mask Absorbers (Chinese Academy of Sciences et al.)
Researchers at Chinese Academy of Sciences, Jilin University, State Key Laboratory of Advanced Manufacturing for Optical Systems, and University of Chinese Academy of Sciences published a technical paper titled “Evaluating an alternative Pt-W alloy as a low-n EUV mask absorber: Film properties and imaging performance.” “In this study, we investigate an alternative Pt-W alloy as... » read more The post Pt-W Alloy Shows Potential For Thinner High-NA EUV Mask Absorbers (Chinese Academy o
Dry-Deposited Resist Shows Different Tone Behavior Under EUV And E-Beam Exposure (KU Leuven, Kunsan, VUB, Imec)
Researchers at KU Leuven, Kunsan National University, Vrije Universiteit Brussel, imec, et al. published “Irradiation-Source-Dependent Tone Conversion in Dry-Deposited Halogenated Amorphous Zeolitic Imidazolate Framework Resists for Electron-Beam and Extreme Ultraviolet Lithography.” Abstract Excerpt: “Dry-deposited metal–organic resists are key enablers for advanced patterning processes in next-generation semiconductor manufacturing. Here, we report halogenated amorphous zeolitic imidazolate fr
Silicon Photonic Modulator Reaches 200 Gb/s PAM4 With Reduced DSP (Science Tokyo, Yokohama, AIST, PETRA)
Researchers from Institute of Science Tokyo, Yokohama National University, AIST, and Photonics Electronics Technology Research Association (PETRA) published a technical paper titled “Reduced-DSP 200G/λ Low-Voltage Slow-Light Silicon Modulator Enabled by Built-In EO Equalizer.” Abstract Excerpt: “Multi-Tb/s optical interconnects for artificial intelligence data centers necessitate high-speed, energy-efficient, and compact transceivers. However, conventional silicon Mach-Zehnder modulators are...
Security-Aware Layer Mapping Reduces Fault Vulnerability In 3D Compute-In-Memory (ASU, U. of Maryland)
Researchers at Arizona State University and University of Maryland published “SEAL: Multitenant Security-Aware Layer Mapping for Heterogeneous 3-D CiM Accelerators.” Abstract: “Heterogeneous 3-D compute-in-memory architectures can combine different memory technologies across stacked tiers to accelerate deep neural network inference, but multitenant deployments introduce security risks through shared power delivery networks. The researchers developed SEAL, a security-aware... » read mo
Neural Networks Speed 3nm Nanosheet SPICE Simulation (TU Munich)
Researchers at Technical University of Munich published “NN-Based Transistor Modeling for Ultra-Fast SPICE Simulation and Standard Cell Library Characterization.” Abstract: “Neural network (NN)-based transistor models have proven to be a promising solution to accelerate device modeling. Although these models demonstrated remarkable speedup in circuit simulations, they were not rigorously tested in complex tasks within standard... » read more The post Neural Networks Speed 3nm Nanosheet SPIC
How Agentic AI Accelerates Edge AI Software Development, Industrial Edge Analytics, Agilex FPGAs: Embedded Week Insights
Here's a roundup of this week's must-read articles. We cover the latest developments on how agentic AI accelerates edge AI software development, the benefits of industrial edge Analytics, Altera's expansion of its defense-grade Agilex FPGAs, and more. Also, check News Archives - Embedded and Technical Articles Archives - Embedded for the complete list of news and articles from our [...] The post How Agentic AI Accelerates Edge AI Software Development, Industrial Edge Analytics, Agilex FPGAs: Emb
Industry Blog
Component guides, sourcing tips, and buying advice
Sourcing Connectors Interconnects Without Regret: A Field Guide
The connector that fails at 3 a.m. costs more than the connector. A field guide to the parameters that matter: current derating, plating, latch types, series se
NTC Thermistor Sourcing: Lead Time Trends & Alternatives for 2026
NTC thermistor lead times are stretching again in 2026, especially automotive-grade parts. What's driving them, which specs matter, and what to qualify as a bac
What We Specify for IoT Devices: Connector and Interconnect Notes
Field notes from IoT BOM reviews: which 1.0–2.5 mm pitch connectors we pick for battery, sensor, and RF links — and which we reject.
What Actually Matters When Specifying Connectors and Interconnects
Voltage ratings distract you. Current per contact, plating thickness, and crimp tooling decide whether a connector survives production. Here's what we check fir
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