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161,827 part numbers available to quote.
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Selection & Sourcing Resources
Choosing the right MLCC
Key considerations for dielectric, voltage, size and temperature characteristics.
Read moreSpecify more than resistance
Look beyond ohmic value. Consider power rating, tolerance, TCR and package size.
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2,528,604 parts available to quote.
EKZN250ELL152MK20S
CAP ALUM 1500UF 20% 25V RADIAL
EMZF160ADA471MJA0G
CAP ALUM 470UF 20% 16V SMD
MAL214252296E3
CAP ALUM 22UF 20% 400V RADIAL
EGXF250ELL162ML15S
CAP ALUM 1600UF 20% 25V RAD TH
400WXA22MEFC16X20
CAP ALUM 22UF 20% 400V RADIAL
EMLE160ADA471MJA0G
CAP ALUM 470UF 20% 16V SMD
35YXH1500MEFC12.5X35
CAP ALUM 1500UF 20% 35V RADIAL
63ZLH470MEFCYD12.5X25
CAP ALUM 470UF 20% 63V RADIAL
EKZN350ELL122MK25S
CAP ALUM 1200UF 20% 35V RADIAL
ELXZ250ETE152MK25S
CAP ALUM 1500UF 20% 25V RADIAL
EKMQ100ELL472MK25S
CAP ALUM 4700UF 20% 10V RADIAL
EGXF161ELL101MU20S
CAP ALUM 100UF 20% 160V RAD TH
400WXA22MEFCGC16X20
CAP ALUM 22UF 20% 400V RADIAL
UHE1E182MHD6TN
CAP ALUM 1800UF 20% 25V RADIAL
25ZL2700MEFC16X25
CAP ALUM 2700UF 20% 25V RADIAL
50TXW470MEFC8X50
CAP ALUM 470UF 20% 50V RADIAL
EKZN6R3ELL562MK25S
CAP ALUM 5600UF 20% 6.3V RADIAL
EKXL401ELL390MU20S
CAP ALUM 39UF 20% 400V RADIAL TH
MAL214054102E3
CAP ALUM 1000UF 20% 10V RADIAL
250PX100MEFC16X25
CAP ALUM 100UF 20% 250V RADIAL
EKZE100ETE222MK20S
CAP ALUM 2200UF 20% 10V RADIAL
EEU-FC2A181B
CAP ALUM 180UF 20% 100V RADIAL
35YXH1500MEFCG412.5X35
CAP ALUM 1500UF 20% 35V RADIAL
16ZLH3900MEFCG412.5X35
CAP ALUM 3900UF 20% 16V RADIAL
450BXC15MEFC12.5X25
CAP ALUM 15UF 20% 450V RADIAL
UCA2C101MHD
CAP ALUM 100UF 20% 160V RADIAL
MAL214056331E3
CAP ALUM 330UF 20% 25V RADIAL
250PX100MEFCGC16X25
CAP ALUM 100UF 20% 250V RADIAL
EKZE160ETD152MK20S
CAP ALUM 1500UF 20% 16V RADIAL
MAL214231102E3
CAP ALUM 1000UF 20% 50V RADIAL
25ZL2700MEFCGC16X25
CAP ALUM 2700UF 20% 25V RADIAL
MAL203865222E3
CAP ALUM 2200UF 20% 16V RADIAL
50ZLH820MEFCGC16X20
CAP ALUM 820UF 20% 50V RADIAL
MAL214660471E3
CAP ALUM 470UF 20% 35V RADIAL
MAL214056471E3
CAP ALUM 470UF 20% 25V RADIAL
420KXW33MEFC10X40
CAP ALUM 33UF 20% 420V RADIAL
EKZE250ETD102MK20S
CAP ALUM 1000UF 20% 25V RADIAL
MAL214236222E3
CAP ALUM 2200UF 20% 25V RADIAL
UVY0J682MHD
CAP ALUM 6800UF 20% 6.3V RADIAL
109CKE6R3M
CAP ALUM 10000UF 20% 6.3V RADIAL
686TXK250M
CAP ALUM 68UF 20% 250V RADIAL
MAL214661331E3
CAP ALUM 330UF 20% 50V RADIAL
MAL214058101E3
CAP ALUM 100UF 20% 63V RADIAL
UPJ1H821MHD6
CAP ALUM 820UF 20% 50V RADIAL
EKZE250ETE102MK20S
CAP ALUM 1000UF 20% 25V RADIAL
MAL214239221E3
CAP ALUM 220UF 20% 100V RADIAL
25ZL2200MEFCG412.5X35
CAP ALUM 2200UF 20% 25V RADIAL
109CKH6R3M
CAP ALUM 10000UF 20% 6.3V RADIAL
Industry News
Latest from electronics industry
Qt Group Introduces Clate for AI-Powered Embedded UX Design
Qt Group has announced Clate, a design tool developed specifically for user interface and user experience (UI/UX) design on embedded devices. Introduced at Qt World Summit 2026, the platform combines a no-code workspace with AI-native features to help designers create functional interfaces for real-world hardware, including systems with limited processing power and memory. Unlike general-purpose [...] The post Qt Group Introduces Clate for AI-Powered Embedded UX Design appeared first on Embedded
ChipAgents Expands Full-Stack Agentic AI Across Digital and Analog Chip Design
ChipAgents, the category leader in agentic AI platforms for semiconductor design, announced the expansion of its AI-native engineering platform across digital and analog chip design, bringing more of the semiconductor development flow onto a shared agentic foundation. The post ChipAgents Expands Full-Stack Agentic AI Across Digital and Analog Chip Design appeared first on Semiconductor Digest.
Lam and imec Expand Collaboration to Advance Manufacturability of Next-Gen 3D Integration Technologies
Lam has extended its long-standing strategic collaboration with imec, a world-leading research and innovation center in advanced semiconductor technologies, to include two new joint research and development focuses: enabling advanced 3D integration and advancing Aether® dry resist for future high-NA EUV patterning. The post Lam and imec Expand Collaboration to Advance Manufacturability of Next-Gen 3D Integration Technologies appeared first on Semiconductor Digest.
SEMI Scales Up Workforce Programs as U.S. Talent Gap Nears 200,000
“Our industry in the U.S. is going to be almost 200,000 people short in the next few years,” said Shari Liss, SEMI’s vice president of global workforce development and initiatives. The post SEMI Scales Up Workforce Programs as U.S. Talent Gap Nears 200,000 appeared first on Semiconductor Digest.
When Engineering Apps Need Agentic AI
Engineering teams often turn expert workflows into custom apps. That makes sense because a few engineers may own the analysis code, simulation model, or test workflow, while many more users need to run it, inspect results, compare cases, and make decisions from the outputs. As these apps become broader team tools, the scale and breadth [...] The post When Engineering Apps Need Agentic AI appeared first on Embedded.
Enphase, Infineon Develop 900 V GaN Bidirectional Switches
Enphase and Infineon are integrating 900 V GaN bidirectional switches into SST systems designed for AI data center power conversion. The post Enphase, Infineon Develop 900 V GaN Bidirectional Switches appeared first on Power Electronics News.
Industry Blog
Component guides, sourcing tips, and buying advice
What We Specify for Smart Home: Connectors Interconnects Notes
Field wiring, wire-to-board and outdoor connectors we specify for smart home designs — JST XH, Molex Micro-Fit 3.0, WAGO levers — with derating and lead-time no
Sourcing Connectors Interconnects Without Regret: A Field Guide
The connector that fails at 3 a.m. costs more than the connector. A field guide to the parameters that matter: current derating, plating, latch types, series se
NTC Thermistor Sourcing: Lead Time Trends & Alternatives for 2026
NTC thermistor lead times are stretching again in 2026, especially automotive-grade parts. What's driving them, which specs matter, and what to qualify as a bac
What We Specify for IoT Devices: Connector and Interconnect Notes
Field notes from IoT BOM reviews: which 1.0–2.5 mm pitch connectors we pick for battery, sensor, and RF links — and which we reject.
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