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Choosing the right MLCC
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2,528,599 parts available to quote.
337SAK100M
CAP ALUM 330UF 20% 100V RADIAL
ELXY160ELL122ML15S
CAP ALUM 1200UF 20% 16V RADIAL
ESMQ100ELL332MK20S
CAP ALUM 3300UF 20% 10V RADIAL
B41231A8188M000
CAP ALUM 1800UF 20% 63V SNAP
B41866C7108M009
CAP ALUM 1000UF 20% 35V RADIAL
B41252A5478M007
CAP ALUM 4700UF 20% 25V SNAP
MAL215252339E3
CAP ALUM 33UF 20% 200V RADIAL
UEP1V221MHD1TO
CAP ALUM 220UF 20% 35V RADIAL
B41866C4228M000
CAP ALUM 2200UF 20% 16V RADIAL
400QXW47M10X38.5
CAP ALUM 47UF 20% 400V RADIAL
MAL204851471E3
CAP ALUM 470UF 20% 50V RADIAL
UUN1V101MNQ1MS
CAP ALUM 100UF 20% 35V SMD
ELXZ250ETD102MK20S
CAP ALUM 1000UF 20% 25V RADIAL
UPJ1H391MHD6
CAP ALUM 390UF 20% 50V RADIAL
UPM0J392MHD6TN
CAP ALUM 3900UF 20% 6.3V RADIAL
UEP2A330MHD1TO
CAP ALUM 33UF 20% 100V RADIAL
UHE2A181MHD6TN
CAP ALUM 180UF 20% 100V RADIAL
EKXL421ELL470MK30S
CAP ALUM 47UF 20% 420V RADIAL TH
MAL204854222E3
CAP ALUM 2200UF 20% 10V RADIAL
MAL203029109E3
CAP ALUM 10UF 100V AXIAL
ELXZ250ETE102MK20S
CAP ALUM 1000UF 20% 25V RADIAL
200BXC68MEFC16X20
CAP ALUM 68UF 20% 200V RADIAL
EEU-FM0J682B
CAP ALUM 6800UF 20% 6.3V RADIAL
UEP1H101MPD1TD
CAP ALUM 100UF 20% 50V RADIAL
UPM1K271MHD6
CAP ALUM 270UF 20% 80V RADIAL
B43858A1107M000
CAP ALUM 100UF 20% 160V RADIAL
MAL204856102E3
CAP ALUM 1000UF 20% 25V RADIAL
UUJ2E220MNQ6MS
CAP ALUM 22UF 20% 250V SMD
ELXZ350ETD681MK20S
CAP ALUM 680UF 20% 35V RADIAL
250BXA47MEFC16X20
CAP ALUM 47UF 20% 250V RADIAL
80ZLH390MEFCG412.5X30
CAP ALUM 390UF 20% 80V RADIAL
EDH106M400A9RAA
CAP ALUM 10UF 20% 400V SMD
ESMQ350ELL102MK20S
CAP ALUM 1000UF 20% 35V RADIAL
25ZLJ2200MG412.5X30
CAP ALUM 2200UF 20% 25V RADIAL
MAL204858331E3
CAP ALUM 330UF 20% 63V RADIAL
EDH335M400S9RAA
CAP ALUM 3.3UF 20% 400V SMD
UHW1E122MPD1TD
CAP ALUM 1200UF 20% 25V RADIAL
450BXC22MEFC12.5X30
CAP ALUM 22UF 20% 450V RADIAL
226KFM400MQU
CAP ALUM 22UF 20% 400V RADIAL
ELXV350ELL122MK35S
CAP ALUM 1200UF 20% 35V RADIAL
EKZN100ELL392MK25S
CAP ALUM 3900UF 20% 10V RADIAL
16ZLH4700MEFCCC16X25
CAP ALUM 4700UF 20% 16V RADIAL
MAL215237478E3
CAP ALUM 4.7UF 20% 450V RADIAL
EKZE630ELL561MK35S
CAP ALUM 560UF 20% 63V RADIAL
UCY2E390MPD
CAP ALUM 39UF 20% 250V RADIAL
EMLE6R3ADA102MJA0G
CAP ALUM 1000UF 20% 6.3V SMD
UHD1H681MHD
CAP ALUM 680UF 20% 50V RADIAL
ELXV6R3ELL472MK35S
CAP ALUM 4700UF 20% 6.3V RADIAL
Industry News
Latest from electronics industry
Wafer-Level Burn-In for Improved WBG Device Reliability
Wafer-level burn-in screens SiC and GaN devices for infant mortality failures before packaging, improving module yields and reliability. The post Wafer-Level Burn-In for Improved WBG Device Reliability appeared first on Power Electronics News.
Microchip Achieves Key Milestones in PIC64-HPSC Spaceflight Computing Development
As spacecraft and satellites become more autonomous and rely on software to perform complex tasks, they need faster and more reliable onboard computing systems. These systems must also withstand harsh space conditions while maintaining security and dependable performance. Microchip Technology has announced several key developments in its PIC64-HPSC high-performance space computing series. The 64-bit multicore […] The post Microchip Achieves Key Milestones in PIC64-HPSC Spaceflight Computin
From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing
High-power impulse magnetron sputtering (HiPIMS) produces denser, better-adhering films than conventional sputtering, but scaling it to 200mm-plus substrates and inline production takes more than turning up the power. Authors from VON ARDENNE describe the engineering investment needed to move the technique from the lab into high-volume manufacturing. The post From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing appeared first on Semiconductor Digest.
Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography
Plasma dicing offers clear advantages over saw and laser singulation for thin wafers, hybrid bonding and HBM: throughput that doesn’t depend on die count, dicing streets as narrow as 5 µm and less mechanical stress. But bumps, copper pillars and cavities make it hard to protect the die surface during plasma etching, and conventional spin coating struggles to cover that topography. The post Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography appeared first
Advanced Packaging Process Control Through Full-Field Wafer Shape Using WFPI
Backside power delivery networks and HBM stacks depend on wafer bonding with tight pitches and overlay budgets, and even small bonding-induced distortions can turn into yield loss in downstream CMP, lithography and stacking. Traditional metrology often can’t deliver fast, full-wafer, non-destructive measurements at the speed high-volume manufacturing requires. The post Advanced Packaging Process Control Through Full-Field Wafer Shape Using WFPI appeared first on Semiconductor Digest.
“We’re Redefining Vehicular Security in Software Defined Vehicles” — R.V. Raghu, Director, Versatilist Consulting India
Beyond Physical Perimeters: Transitioning to Attack Surface Management With the rapid emergence of Software-Defined Vehicles (SDVs) and Advanced Driver Assistance Systems (ADAS), modern automobiles have evolved into distributed computing platforms—effectively data centres on wheels. This transformation requires a fundamental shift in how the industry conceptualises automotive security. Traditional security models relied on physical perimeters, drawing […] The post “We’re Redefining V
Industry Blog
Component guides, sourcing tips, and buying advice
What We Specify for Smart Home: Connectors Interconnects Notes
Field wiring, wire-to-board and outdoor connectors we specify for smart home designs — JST XH, Molex Micro-Fit 3.0, WAGO levers — with derating and lead-time no
Sourcing Connectors Interconnects Without Regret: A Field Guide
The connector that fails at 3 a.m. costs more than the connector. A field guide to the parameters that matter: current derating, plating, latch types, series se
NTC Thermistor Sourcing: Lead Time Trends & Alternatives for 2026
NTC thermistor lead times are stretching again in 2026, especially automotive-grade parts. What's driving them, which specs matter, and what to qualify as a bac
What We Specify for IoT Devices: Connector and Interconnect Notes
Field notes from IoT BOM reviews: which 1.0–2.5 mm pitch connectors we pick for battery, sensor, and RF links — and which we reject.
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