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ELXZ350EC3102MK25S
CAP ALUM 1000UF 20% 35V RADIAL
10YXH2700MEFC18X16
CAP ALUM 2700UF 20% 10V RAD TH
EKZE250ETD152MK25S
CAP ALUM 1500UF 20% 25V RADIAL
35YXG1000MEFC18X16
CAP ALUM 1000UF 20% 35V RADIAL
MAL214834222E3
CAP ALUM 2200UF 20% 10V RADIAL
EEE-FK1H151GV
CAP ALUM 150UF 20% 50V SMD
100YXH150MEFCGC16X16
CAP ALUM 150UF 20% 100V RADIAL
UKL1E102MHD
CAP ALUM 1000UF 20% 25V RADIAL
50YXH560MEFC18X16
CAP ALUM 560UF 20% 50V RADIAL TH
EKZE250ETE152MK25S
CAP ALUM 1500UF 20% 25V RADIAL
35YXG1000MEFCGC18X16
CAP ALUM 1000UF 20% 35V RADIAL
MAL214835152E3
CAP ALUM 1500UF 20% 16V RADIAL
EGXE100ELL222MK25S
CAP ALUM 2200UF 20% 10V RADIAL
450PX22MEFC12.5X25
CAP ALUM 22UF 20% 450V RADIAL
UKL1J331MHD
CAP ALUM 330UF 20% 63V RADIAL
107BPA016M
CAP ALUM 100UF 20% 16V AXIAL
EEE-FK1J680UV
CAP ALUM 68UF 20% 63V SMD
EGXF161ELL151MK30S
CAP ALUM 150UF 20% 160V RAD TH
MAL214836102E3
CAP ALUM 1000UF 20% 25V RADIAL
517D336M160DG6AE3
CAP ALUM 33UF 20% 160V RADIAL
450PX22MEFCG412.5X25
CAP ALUM 22UF 20% 450V RADIAL
UBT2C470MHD8TO
CAP ALUM 47UF 20% 160V RADIAL
25YXH2700MEFC16X25
CAP ALUM 2700UF 20% 25V RADIAL
EKZN100ELL472MK30S
CAP ALUM 4700UF 20% 10V RADIAL
ELXV630ELL471ML25S
CAP ALUM 470UF 20% 63V RADIAL
MAL214839101E3
CAP ALUM 100UF 20% 100V RADIAL
517D337M063DG6AE3
CAP ALUM 330UF 20% 63V RADIAL
6.3ZLH8200MEFC16X25
CAP ALUM 8200UF 20% 6.3V RADIAL
25YXH2700MEFCGC16X25
CAP ALUM 2700UF 20% 25V RADIAL
EKZN350ELL152MK30S
CAP ALUM 1500UF 20% 35V RADIAL
EKZE160ETD222MK25S
CAP ALUM 2200UF 20% 16V RADIAL
B41866C4278M000
CAP ALUM 2700UF 20% 16V RADIAL
477TMA035M
CAP ALUM 470UF 20% 35V AXIAL
517D477M050DG6AE3
CAP ALUM 470UF 20% 50V RADIAL
6.3ZLH8200MEFCGC16X25
CAP ALUM 8200UF 20% 6.3V RADIAL
UAQ2D470MHD6TO
CAP ALUM 47UF 20% 200V RADIAL
EKZN6R3ELL682MK30S
CAP ALUM 6800UF 20% 6.3V RADIAL
EKZE160ETE222MK25S
CAP ALUM 2200UF 20% 16V RADIAL
B41866D5228M000
CAP ALUM 2200UF 20% 25V RADIAL
ECA-2DHG101B
CAP ALUM 100UF 20% 200V RADIAL
80TXW100MEFC8X25
CAP ALUM 100UF 20% 80V RADIAL
ELXV500EMC681MK35S
CAP ALUM 680UF 20% 50V RADIAL
UHV1C272MHD1TO
CAP ALUM 2700UF 20% 16V RADIAL
UUG1J101MNQ1MS
CAP ALUM 100UF 20% 63V SMD
EKZE350ETD102MK25S
CAP ALUM 1000UF 20% 35V RADIAL
B41866E5228M000
CAP ALUM 2200UF 20% 25V RADIAL
ECA-2VHG330B
CAP ALUM 33UF 20% 350V RADIAL
10ZLH6800MEFCGC16X25
CAP ALUM 6800UF 20% 10V RADIAL
Industry News
Latest from electronics industry
Wafer-Level Burn-In for Improved WBG Device Reliability
Wafer-level burn-in screens SiC and GaN devices for infant mortality failures before packaging, improving module yields and reliability. The post Wafer-Level Burn-In for Improved WBG Device Reliability appeared first on Power Electronics News.
Microchip Achieves Key Milestones in PIC64-HPSC Spaceflight Computing Development
As spacecraft and satellites become more autonomous and rely on software to perform complex tasks, they need faster and more reliable onboard computing systems. These systems must also withstand harsh space conditions while maintaining security and dependable performance. Microchip Technology has announced several key developments in its PIC64-HPSC high-performance space computing series. The 64-bit multicore […] The post Microchip Achieves Key Milestones in PIC64-HPSC Spaceflight Computin
From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing
High-power impulse magnetron sputtering (HiPIMS) produces denser, better-adhering films than conventional sputtering, but scaling it to 200mm-plus substrates and inline production takes more than turning up the power. Authors from VON ARDENNE describe the engineering investment needed to move the technique from the lab into high-volume manufacturing. The post From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing appeared first on Semiconductor Digest.
Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography
Plasma dicing offers clear advantages over saw and laser singulation for thin wafers, hybrid bonding and HBM: throughput that doesn’t depend on die count, dicing streets as narrow as 5 µm and less mechanical stress. But bumps, copper pillars and cavities make it hard to protect the die surface during plasma etching, and conventional spin coating struggles to cover that topography. The post Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography appeared first
Advanced Packaging Process Control Through Full-Field Wafer Shape Using WFPI
Backside power delivery networks and HBM stacks depend on wafer bonding with tight pitches and overlay budgets, and even small bonding-induced distortions can turn into yield loss in downstream CMP, lithography and stacking. Traditional metrology often can’t deliver fast, full-wafer, non-destructive measurements at the speed high-volume manufacturing requires. The post Advanced Packaging Process Control Through Full-Field Wafer Shape Using WFPI appeared first on Semiconductor Digest.
“We’re Redefining Vehicular Security in Software Defined Vehicles” — R.V. Raghu, Director, Versatilist Consulting India
Beyond Physical Perimeters: Transitioning to Attack Surface Management With the rapid emergence of Software-Defined Vehicles (SDVs) and Advanced Driver Assistance Systems (ADAS), modern automobiles have evolved into distributed computing platforms—effectively data centres on wheels. This transformation requires a fundamental shift in how the industry conceptualises automotive security. Traditional security models relied on physical perimeters, drawing […] The post “We’re Redefining V
Industry Blog
Component guides, sourcing tips, and buying advice
What We Specify for Smart Home: Connectors Interconnects Notes
Field wiring, wire-to-board and outdoor connectors we specify for smart home designs — JST XH, Molex Micro-Fit 3.0, WAGO levers — with derating and lead-time no
Sourcing Connectors Interconnects Without Regret: A Field Guide
The connector that fails at 3 a.m. costs more than the connector. A field guide to the parameters that matter: current derating, plating, latch types, series se
NTC Thermistor Sourcing: Lead Time Trends & Alternatives for 2026
NTC thermistor lead times are stretching again in 2026, especially automotive-grade parts. What's driving them, which specs matter, and what to qualify as a bac
What We Specify for IoT Devices: Connector and Interconnect Notes
Field notes from IoT BOM reviews: which 1.0–2.5 mm pitch connectors we pick for battery, sensor, and RF links — and which we reject.
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