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Choosing the right MLCC
Key considerations for dielectric, voltage, size and temperature characteristics.
Read moreSpecify more than resistance
Look beyond ohmic value. Consider power rating, tolerance, TCR and package size.
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2,528,471 parts available to quote.
400BXC22MEFCG412.5X25
CAP ALUM 22UF 20% 400V RADIAL
MAL214864222E3
CAP ALUM 2200UF 20% 10V RADIAL
250TXW47MEFR10X25
CAP ALUM 47UF 20% 250V RADIAL TH
35YXG1800MEFCGC16X25
CAP ALUM 1800UF 20% 35V RADIAL
EEU-FC1E122B
CAP ALUM 1200UF 20% 25V RADIAL
MAL213661151E3
CAP ALUM 150UF 20% 50V RADIAL
ELXZ630ELL471MK25S
CAP ALUM 470UF 20% 63V RADIAL
MAL204858221E3
CAP ALUM 220UF 20% 63V RADIAL
477KBM050M
CAP ALUM 470UF 20% 50V RADIAL
MAL214865152E3
CAP ALUM 1500UF 20% 16V RADIAL
315BXA22M16X16
CAP ALUM 22UF 20% 315V RADIAL
50ZLH820MEFCG412.5X35
CAP ALUM 820UF 20% 50V RADIAL
EEU-FC1H561B
CAP ALUM 560UF 20% 50V RADIAL
MAL213661181E3
CAP ALUM 180UF 20% 50V RADIAL
UEP2A220MPD1TD
CAP ALUM 22UF 20% 100V RADIAL
MAL213661121E3
CAP ALUM 120UF 20% 50V RADIAL
16ZLH2700MEFC12.5X30
CAP ALUM 2700UF 20% 16V RADIAL
MAL214866102E3
CAP ALUM 1000UF 20% 25V RADIAL
UBT2V100MPD8
CAP ALUM 10UF 20% 350V RADIAL
6.3YXG6800MEFC12.5X40
CAP ALUM 6800UF 20% 6.3V RADIAL
25WA2200MEFC16X20
CAP ALUM 2200UF 20% 25V RADIAL
MAL213665681E3
CAP ALUM 680UF 20% 16V RADIAL
B41888C6687M000
CAP ALUM 680UF 20% 50V RADIAL
MAL213664681E3
CAP ALUM 680UF 20% 10V RADIAL
16ZLH2700MEFCG412.5X30
CAP ALUM 2700UF 20% 16V RADIAL
MAL214869101E3
CAP ALUM 100UF 20% 100V RADIAL
ESU107M200AM7AA
CAP ALUM 100UF 20% 200V RADIAL
500BXC10MEFCG412.5X20
CAP ALUM 10UF 20% 500V RADIAL
25WA2200MEFCGC16X20
CAP ALUM 2200UF 20% 25V RADIAL
MAL213668121E3
CAP ALUM 120UF 20% 63V RADIAL
108SAK050M
CAP ALUM 1000UF 20% 50V RADIAL
MAL213666331E3
CAP ALUM 330UF 20% 25V RADIAL
EEU-ED2C820B
CAP ALUM 82UF 20% 160V RADIAL
6.3ZL5600MEFC12.5X35
CAP ALUM 5600UF 20% 6.3V RADIAL
EKXL421ELL330MK25S
CAP ALUM 33UF 20% 420V RADIAL TH
EEU-ED2C820
CAP ALUM 82UF 20% 160V RADIAL
AEA1010152M006R
ALUMINUM CAP
MAL213669689E3
CAP ALUM 68UF 20% 100V RADIAL
UPJ1J181MHD6
CAP ALUM 180UF 20% 63V RADIAL
MAL213668689E3
CAP ALUM 68UF 20% 63V RADIAL
EEU-ED2W150B
CAP ALUM 15UF 20% 450V RADIAL
6.3ZL5600MEFCG412.5X35
CAP ALUM 5600UF 20% 6.3V RADIAL
MAL215232229E3
CAP ALUM 22UF 20% 200V RADIAL
UHD1A472MHD
CAP ALUM 4700UF 20% 10V RADIAL
25ZL1800MEFC12.5X30
CAP ALUM 1800UF 20% 25V RADIAL
10YXG4700MEFC12.5X35
CAP ALUM 4700UF 20% 10V RADIAL
MAL214033122E3
CAP ALUM 1200UF 20% 6.3V RADIAL
UUQ0J471MCL6GS
CAP ALUM 470UF 20% 6.3V SMD
Industry News
Latest from electronics industry
HANMI Semiconductor Opens HANMI USA
HANMI Semiconductor today announced that it has opened U.S. subsidiary HANMI USA, a major step in expanding its presence in the U.S. semiconductor market. The post HANMI Semiconductor Opens HANMI USA appeared first on Semiconductor Digest.
Electronic System Design Industry Posts $5.7 Billion in Revenue in Q2 2026, ESD Alliance Reports
Electronic System Design (ESD) industry revenue increased 12.2% to $5,710.8 million in the second quarter of 2026 from the $5,089.4 million registered in the second quarter of 2025, the ESD Alliance, a SEMI Technology Coalition, announced today. The post Electronic System Design Industry Posts $5.7 Billion in Revenue in Q2 2026, ESD Alliance Reports appeared first on Semiconductor Digest.
Seco Modular Vision 10.1 MX95 Enters Mass Production
Seco has moved its Modular Vision 10.1 MX95 industrial human-machine interface (HMI) platform into mass production, making it available to original equipment manufacturers (OEMs) and system integrators developing new industrial interfaces or upgrading existing machine designs. Based on NXP's i.MX 95 applications processor, the platform integrates computing, display, industrial connectivity, and software into a single [...] The post Seco Modular Vision 10.1 MX95 Enters Mass Production appeared fi
Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)
Researchers at Argonne National Laboratory and the University of Illinois Urbana-Champaign published a technical paper titled “Agentic AI for Heterogeneous System Design Across Chip, Scale-Up, and Scale-Out Domains.” Abstract Excerpt: “The design space of modern AI/HPC systems has expanded rapidly across compute architectures, including GPUs, dataflow processors, and RISC-V accelerators; memory technologies, including HBM, GDDR,... » read more The post Agentic AI Explores Heterogeneous Chip
Industrial Edge Analytics: Detect Issues Faster and Improve Maintenance
Edge computing processes data locally, transforming sensor data into decision-making inference close to the source. It delivers lower latency, higher accuracy, and faster decision-making for real-time industrial analytics at the edge. Embedded monitoring systems comprise sensors, DC/DC converters, and other signal-conditioning circuits, as well as microcontrollers (MCUs) or processors and communication interfaces. Edge computing provides [...] The post Industrial Edge Analytics: Detect Issues Fa
The Workforce Behind the Roadmap
For three years, every semiconductor conference has featured some version of the same slide: the industry doesn’t have enough people to build what it’s promising. This month, SEMI’s National Network for Microelectronics Education (NNME), backed by the National Science Foundation and the U.S. Department of Commerce, named its first Industry Advisory Committee to turn those warnings into a national strategy, against a projected U.S. shortfall of 127,000 to 157,000 workers by 2030. The post The Wor
Industry Blog
Component guides, sourcing tips, and buying advice
NTC Thermistor Sourcing: Lead Time Trends & Alternatives for 2026
NTC thermistor lead times are stretching again in 2026, especially automotive-grade parts. What's driving them, which specs matter, and what to qualify as a bac
What We Specify for IoT Devices: Connector and Interconnect Notes
Field notes from IoT BOM reviews: which 1.0–2.5 mm pitch connectors we pick for battery, sensor, and RF links — and which we reject.
What Actually Matters When Specifying Connectors and Interconnects
Voltage ratings distract you. Current per contact, plating thickness, and crimp tooling decide whether a connector survives production. Here's what we check fir
Hall Effect Sensor Triggering Early? Magnet Placement & Hysteresis Fixes
Hall sensors triggering early? Most false triggers trace to BOP/BRP hysteresis, a magnet too strong or too close, and clone-to-clone threshold scatter. Here's t
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