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Choosing the right MLCC
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2,528,481 parts available to quote.
380LX682M016H012
CAP ALUM 6800UF 20% 16V SNAP
EDH108M050S9TAA
CAP ALUM 1000UF 20% 50V SMD
EGPA250ELL222MU25S
CAP ALUM 2200UF 20% 25V RADIAL
B41231C4189M000
CAP ALUM 18000UF 20% 16V SNAP
AFK337M25F24VT-F
CAP ALUM 330UF 20% 25V SMD
MAL213638331E3
CAP ALUM 330UF 20% 63V RADIAL
25TRV1500M16X16.5
CAP ALUM 1500UF 20% 25V SMD
UBT2G330MHD8TN
CAP ALUM 33UF 20% 400V RADIAL
380LQ123M016H022
CAP ALUM 12000UF 20% 16V SNAP
50USC2700MEFCSN20X30
CAP ALUM 2700UF 20% 50V SNAP
380LX221M200H012
CAP ALUM 220UF 20% 200V SNAP
338TMA025M
CAP ALUM 3300UF 20% 25V AXIAL
AFK477M06F24VT-F
CAP ALUM 470UF 20% 6.3V SMD
MAL213639151E3
CAP ALUM 150UF 20% 100V RADIAL
UPA1C392MHD
CAP ALUM 3900UF 20% 16V RADIAL
UCY2V680MHD6
CAP ALUM 68UF 20% 350V RADIAL
380LX681M100H012
CAP ALUM 680UF 20% 100V SNAP
MAL204830222E3
CAP ALUM 2200UF 20% 35V RADIAL
380LX562M025H012
CAP ALUM 5600UF 20% 25V SNAP
ESMG160ELL682MLN3S
CAP ALUM 6800UF 20% 16V RADIAL
AFK477M10F24VT-F
CAP ALUM 470UF 20% 10V SMD
MAL215050152E3
CAP ALUM 1500UF 20% 35V RADIAL
UPA0J822MHD
CAP ALUM 8200UF 20% 6.3V RADIAL
LLS2C391MELZ
CAP ALUM 390UF 20% 160V SNAP
381LX153M010H012
CAP ALUM 15000UF 20% 10V SNAP
MAL204834682E3
CAP ALUM 6800UF 20% 10V RADIAL
381LX102M063H012
CAP ALUM 1000UF 20% 63V SNAP
URZ2C151MHD
CAP ALUM 150UF 20% 160V RADIAL
AFK477M16F24VT-F
CAP ALUM 470UF 20% 16V SMD
MAL215055332E3
CAP ALUM 3300UF 20% 16V RADIAL
SLPX471M180A3P3
CAP ALUM 470UF 20% 180V SNAP
63ZL1000MEFC16X35.5
CAP ALUM 1000UF 20% 63V RADIAL
381LX562M025H012
CAP ALUM 5600UF 20% 25V SNAP
MAL204835472E3
CAP ALUM 4700UF 20% 16V RADIAL
381LX151M200H012
CAP ALUM 150UF 20% 200V SNAP
337BPA050M
CAP ALUM 330UF 20% 50V AXIAL
AFK687M10F24VT-F
CAP ALUM 680UF 20% 10V SMD
MAL215058681E3
CAP ALUM 680UF 20% 63V RADIAL
SLP153M016A7P3
CAP ALUM 15000UF 20% 16V SNAP
63ZL1000MEFCGC16X35.5
CAP ALUM 1000UF 20% 63V RADIAL
UBT2E470MHD
CAP ALUM 47UF 20% 250V RADIAL
MAL204836332E3
CAP ALUM 3300UF 20% 25V RADIAL
160TXW220MEFR10X60
CAP ALUM 220UF 20% 160V RAD TH
227LBA200M2CA
CAP ALUM 220UF 20% 200V SNAP
UPJ0J103MHD6
CAP ALUM 10000UF 20% 6.3V RADIAL
MAL215090105E3
CAP ALUM 1000UF 20% 35V RADIAL
SLPX182M080A3P3
CAP ALUM 1800UF 20% 80V SNAP
MAL202128221E3
CAP ALUM 220UF 20% 63V AXIAL
Industry News
Latest from electronics industry
Simulation-Driven Thermal Modeling for SiC and GaN Converters
SiC and GaN thermal management relies on multiscale simulation spanning device-level FEA to system-level electro-thermal co-simulation. The post Simulation-Driven Thermal Modeling for SiC and GaN Converters appeared first on Power Electronics News.
Chip Industry Technical Paper Roundup: Oct. 20
HBM power consumption; GAAFET leakage pathways; agentic AI for heterogeneous system design; nanoelectromechanical gain-cell eDRAM; AI-accelerated 3D-IC thermal modeling; agentic AI for RTL verification and debugging; thermal side-channel attacks in autonomous vehicles. The post Chip Industry Technical Paper Roundup: Oct. 20 appeared first on Semiconductor Engineering.
HANMI Semiconductor Opens HANMI USA
HANMI Semiconductor today announced that it has opened U.S. subsidiary HANMI USA, a major step in expanding its presence in the U.S. semiconductor market. The post HANMI Semiconductor Opens HANMI USA appeared first on Semiconductor Digest.
Electronic System Design Industry Posts $5.7 Billion in Revenue in Q2 2026, ESD Alliance Reports
Electronic System Design (ESD) industry revenue increased 12.2% to $5,710.8 million in the second quarter of 2026 from the $5,089.4 million registered in the second quarter of 2025, the ESD Alliance, a SEMI Technology Coalition, announced today. The post Electronic System Design Industry Posts $5.7 Billion in Revenue in Q2 2026, ESD Alliance Reports appeared first on Semiconductor Digest.
Seco Modular Vision 10.1 MX95 Enters Mass Production
Seco has moved its Modular Vision 10.1 MX95 industrial human-machine interface (HMI) platform into mass production, making it available to original equipment manufacturers (OEMs) and system integrators developing new industrial interfaces or upgrading existing machine designs. Based on NXP's i.MX 95 applications processor, the platform integrates computing, display, industrial connectivity, and software into a single [...] The post Seco Modular Vision 10.1 MX95 Enters Mass Production appeared fi
Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)
Researchers at Argonne National Laboratory and the University of Illinois Urbana-Champaign published a technical paper titled “Agentic AI for Heterogeneous System Design Across Chip, Scale-Up, and Scale-Out Domains.” Abstract Excerpt: “The design space of modern AI/HPC systems has expanded rapidly across compute architectures, including GPUs, dataflow processors, and RISC-V accelerators; memory technologies, including HBM, GDDR,... » read more The post Agentic AI Explores Heterogeneous Chip
Industry Blog
Component guides, sourcing tips, and buying advice
Sourcing Connectors Interconnects Without Regret: A Field Guide
The connector that fails at 3 a.m. costs more than the connector. A field guide to the parameters that matter: current derating, plating, latch types, series se
NTC Thermistor Sourcing: Lead Time Trends & Alternatives for 2026
NTC thermistor lead times are stretching again in 2026, especially automotive-grade parts. What's driving them, which specs matter, and what to qualify as a bac
What We Specify for IoT Devices: Connector and Interconnect Notes
Field notes from IoT BOM reviews: which 1.0–2.5 mm pitch connectors we pick for battery, sensor, and RF links — and which we reject.
What Actually Matters When Specifying Connectors and Interconnects
Voltage ratings distract you. Current per contact, plating thickness, and crimp tooling decide whether a connector survives production. Here's what we check fir
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