Winbond Electronics8-XDFN Exposed PadRoHS
W25Q32JWXGSQ
IC FLASH
Category
Subcategory
Memory
Package
8-XDFN Exposed Pad
Series
SpiFlash®
Status
Active
Price available on request
MOQ: 1 pcs
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Parameters
| Parameter | Value |
|---|---|
| Brand | Winbond Electronics |
| Model | W25Q32JWXGSQ |
| Package / Case | 8-XDFN Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Series | SpiFlash® |
| Voltage - Supply | 1.7V ~ 1.95V |
| Supplier Device Package | 8-XSON (4x4) |
| RoHS | RoHS |
| Part Status | Active |
Application & Notes
W25Q32JWXGSQ by Winbond Electronics is a commonly used electronic component in the Memory category. Available in 8-XDFN Exposed Pad package with -40°C ~ 125°C (TA) operating temperature range. Contact us for datasheet, pricing, and availability.
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All Technical Specifications
| Technology | FLASH - NOR |
| Access Time | 6 ns |
| Memory Size | 32Mb (4M x 8) |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Clock Frequency | 133 MHz |
| Memory Interface | SPI - Quad I/O |
| Voltage - Supply | 1.7V ~ 1.95V |
| Write Cycle Time - Word, Page | 5ms |
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