Tom Harrison
Embedded Systems Engineer
Shenzhen, China
Tom designs and reviews embedded systems projects at PartsCube Global, from MCU selection to wireless modules. He has built products for IoT, industrial control and consumer devices.
Articles by Tom Harrison (18)
Avoid These 5 Mistakes When Sourcing Board-Mount DC-DC Power Modules
Five common engineering pitfalls in isolated DC-DC converter sourcing — derating curves, input ripple, inrush current, tolerance over-spec, and counterfeit risk
Connectors & Interconnects for IoT Devices: Design Tips & Component Selection
A practical guide to connector selection for IoT hardware — micro-B USB vs USB-C, board-to-wire options, IP ratings, and reliability trade-offs for connected pr
Connectors for Embedded Systems: Design Tips & Component Selection
A practical guide to connector selection for embedded systems covering current rating, mating cycles, pitch, IP rating, and top connector families from Samtec, Hirose, and Molex.
Connectors for IoT Devices: Design Tips & Component Selection
Essential connector selection tips for IoT devices: miniaturization trade-offs, environmental sealing, RF signal integrity, contact plating, and top part recommendations for wireless sensors.
Capacitors for IoT Devices: Design Tips & Component Selection
Key capacitor selection tips for IoT devices: RF decoupling, energy storage for burst transmission, leakage current management, and top part picks for wireless sensor designs.
The Resistor You Pick Can Make or Break an Embedded Design
Pull-up values, ADC input impedance, current sense layout, and TCR — the resistor decisions that silently cause embedded system failures and how to get them right.
Edge Computing Hardware Guide: Gateways, Industrial PCs, Embedded Controllers
Edge hardware tiers compared — from Raspberry Pi CM4 to NVIDIA Jetson to Advantech IPCs. Selection checklist for industrial deployment.
FPGA vs ASIC vs GPU for AI Acceleration: When to Choose Which
FPGA, ASIC, and GPU paths for AI hardware — NRE costs, lead times, performance per watt, and Chinese FPGA alternatives like Gowin and Anlogic.
Wireless Connectivity Compared: BLE, WiFi, LoRa, Zigbee, Thread, Matter, NB-IoT
Every IoT wireless protocol compared — range, data rate, power, cost, and ecosystem. Module selection tips for engineers and buyers.
Sensor Selection Guide for IoT: Temperature, Humidity, Motion, Gas, Environmental
Practical sensor selection with popular parts from Sensirion, Bosch, TDK. Covers temperature, humidity, IMU, gas sensors and Chinese alternatives.
IoT Module Selection Guide: WiFi, BLE, LoRa, NB-IoT, Cellular Compared
Complete IoT connectivity comparison — range, power, cost, and ecosystem. Popular modules from Quectel, Nordic, Espressif, and more.
Automotive-Grade Electronic Components: AEC-Q, Popular Parts, and Sourcing Guide
What AEC-Q qualification means, which parts need it, popular automotive components, and where to source them at competitive prices.
ESP32 vs STM32: Which MCU is Right for Your Project?
ESP32 or STM32? Compare wireless connectivity, processing power, power consumption, ecosystem, and cost. Complete decision guide for IoT and embedded projects.
How to Read Electronic Component Datasheets: A Practical Guide
Learn which sections of a datasheet matter most and which ones to skip. Practical guide for engineers and buyers to quickly extract key specs from IC datasheets.
Chinese MCU Alternatives: GD32, AT32, APM32 & More — 40-80% Cost Savings vs ST/NXP/Microchip
Chinese MCUs offer 40-80% cost savings over Western brands. Covers GD32, AT32, APM32, MM32, HC32 and when to migrate from STM32, LPC, and Kinetis.
MCU Development Boards Compared: Arduino, STM32 Nucleo, ESP32, Raspberry Pi Pico
Complete comparison of popular MCU dev boards: Arduino Uno, STM32 Nucleo, ESP32 DevKit, Raspberry Pi Pico. Features, pricing, ecosystem, and which one to start with.
STM32F103C8T6 Alternatives: GD32, APM32 & More Pin-Compatible MCUs
STM32F103C8T6 shortage? Discover 8 pin-compatible MCU alternatives including GD32F103C8T6, APM32F103C8T6, and AT32F403. Price comparison and migration tips included.
IC Package Types Guide: SOP, QFP, QFN, BGA — What's the Difference?
Complete guide to IC package types: DIP, SOP, QFP, QFN, BGA, and more. Learn package selection criteria for manufacturability, thermal, and cost.