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AEH1213471M025R
ALUMINUM CAP
B41858C5278M000
CAP ALUM 2700UF 20% 25V RADIAL
EKZE160ETD272MK30S
CAP ALUM 2700UF 20% 16V RADIAL
EDH227M063S9SAA
CAP ALUM 220UF 20% 63V SMD
EGXF401ELL270MK25S
CAP ALUM 27UF 20% 400V RADIAL TH
UUN2A330MNQ1MS
CAP ALUM 33UF 20% 100V SMD
ELXV500ELL471MM15S
CAP ALUM 470UF 20% 50V RADIAL
EEU-FK1A472SB
CAP ALUM 4700UF 20% 10V RAD TH
UPS2F330MHD
CAP ALUM 33UF 20% 315V RADIAL
EGXF250ELL122MU15S
CAP ALUM 1200UF 20% 25V RAD TH
50TXW1000MEFC10X50
CAP ALUM 1000UF 20% 50V RAD TH
B41231A4129M000
CAP ALUM 12000UF 20% 16V SNAP
B41252A5478M002
CAP ALUM 4700UF 20% 25V SNAP
EKRG100ELL682MM20S
CAP ALUM 6800UF 20% 10V RADIAL
URY2D330MHD
CAP ALUM 33UF 20% 200V RADIAL
860080578020
CAP ALUM 820UF 20% 35V RADIAL
EDH106M200S9RAA
CAP ALUM 10UF 20% 200V SMD
UHV1C332MHD
CAP ALUM 3300UF 20% 16V RADIAL
UUJ2E100MNQ1MS
CAP ALUM 10UF 20% 250V SMD
35ZT560M12.5X25
CAP ALUM 560UF 20% 35V RADIAL
107CKE250MQV
CAP ALUM 100UF 20% 250V RADIAL
EKYA250ELL392ML25S
CAP ALUM 3900UF 20% 25V RADIAL
UPM1K181MHD6
CAP ALUM 180UF 20% 80V RADIAL
UEP1C102MHD
CAP ALUM 1000UF 20% 16V RADIAL
ESMQ201ELL470MK20S
CAP ALUM 47UF 20% 200V RADIAL
URS2G220MHD
CAP ALUM 22UF 20% 400V RADIAL
UUJ2G4R7MNQ1MS
CAP ALUM 4.7UF 20% 400V SMD
35ZT560MG412.5X25
CAP ALUM 560UF 20% 35V RADIAL
EDH687M035S9RAA
CAP ALUM 680UF 20% 35V SMD
EKXL401ELL680MM20S
CAP ALUM 68UF 20% 400V RADIAL TH
MAL203830102E3
CAP ALUM 1000UF 20% 35V RADIAL
EDH227M063S9RAA
CAP ALUM 220UF 20% 63V SMD
EEU-FC1A332SB
CAP ALUM 3300UF 20% 10V RADIAL
B41858C4398M000
CAP ALUM 3900UF 20% 16V RADIAL
UHV1V182MHD
CAP ALUM 1800UF 20% 35V RADIAL
MAL215257109E3
CAP ALUM 10UF 20% 450V RADIAL
MAL214830102E3
CAP ALUM 1000UF 20% 35V RADIAL
EKXL451ELL560MK35S
CAP ALUM 56UF 20% 450V RADIAL TH
MAL215263229E3
CAP ALUM 22UF 20% 250V RADIAL
EEU-FK0J562SB
CAP ALUM 5600UF 20% 6.3V RAD TH
UUG2G4R7MNQ1MS
CAP ALUM 4.7UF 20% 400V SMD
EGXE351ELL220MK25S
CAP ALUM 22UF 20% 350V RADIAL
100RX30220M16X25
CAP ALUM 220UF 20% 100V RADIAL
EDH107M100S9RAA
CAP ALUM 100UF 20% 100V SMD
MAL214831681E3
CAP ALUM 680UF 20% 50V RADIAL
UBY1V182MHL
CAP ALUM 1800UF 20% 35V RADIAL
EEU-FK1C392SB
CAP ALUM 3900UF 20% 16V RAD TH
EDH476M100S9RAA
CAP ALUM 47UF 20% 100V SMD
Industry News
Latest from electronics industry
ABR Launches Speech AI SDK for Alif Processors
Applied Brain Research (ABR) has announced the general availability of its speech AI software development kit (SDK) for Zephyr RTOS on the Alif Semiconductor Ensemble family of edge AI processors. The software enables streaming automatic speech recognition and text-to-speech synthesis to run entirely on-device, without requiring a cloud connection. It is designed for low-power embedded [...] The post ABR Launches Speech AI SDK for Alif Processors appeared first on Embedded.
AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)
Researchers at Materials Center Leoben, PVA TePla, and Advanced Semiconductor Engineering (ASE) published “AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging.” Abstract Excerpt: “Traditional failure-analysis (FA) methods face growing challenges due to the increasing miniaturization and complexity of modern semiconductor devices. In particular, the detection of cracks in the extreme low K... » read more The post AI Image Enhancement Impro
3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB)
Researchers at imec and Vrije Universiteit Brussels published “Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI.” Abstract “GPU compute resources are scaling to support growing AI workloads, leading to further rises in the climate change impact of hyperscale data centers that rely on high-performance GPUs. To model how packaging decisions... » read more The post 3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB) appeared first on
Quantum Interconnects Link Two 120-Qubit Processors (IBM Research)
Researchers at IBM Research published “Meter-scale quantum interconnects between large quantum processors.” Abstract Excerpt: “Modular quantum architecture requires long-distance quantum interconnects to stitch together individual processor modules. Such interconnects, long-distance couplers or L-couplers, must support coherent quantum operation over meter-scale distances and scale to multiple connections between any two modules. Here we demonstrate four L-couplers... » read more The
Hardware Defense Blocks Memory-Dependent Prefetcher Leakage (KU Leuven)
Researchers at KU Leuven and EURECOM published “SecDMP: Provably Secure Data Memory-Dependent Prefetching.” Abstract Excerpt: “In this work, we address this gap by designing a defense that is both secure and efficient. First, we propose a classification of DMP leakage, categorize existing and novel attacks, and analyze which leakage classes are mitigated by existing defenses.... » read more The post Hardware Defense Blocks Memory-Dependent Prefetcher Leakage (KU Leuven) appeared first
Co-Optimizing Access Points Improves Analog Placement (UT Austin)
Researchers at the University of Texas at Austin published “APPlace: Co-Optimizing Device Locations and Access Points for Routing-Aware Analog Placement.” Abstract “Analog layout automation remains challenging in Analog/Mixed-Signal circuit design, because parasitics and mismatches introduced during layout strongly affect circuit performance. Placement is especially critical among the layout stages, as it constrains the routing solution... » read more The post Co-Optimizing Access Poi
Industry Blog
Component guides, sourcing tips, and buying advice
What We Specify for Smart Home: Connectors Interconnects Notes
Field wiring, wire-to-board and outdoor connectors we specify for smart home designs — JST XH, Molex Micro-Fit 3.0, WAGO levers — with derating and lead-time no
Sourcing Connectors Interconnects Without Regret: A Field Guide
The connector that fails at 3 a.m. costs more than the connector. A field guide to the parameters that matter: current derating, plating, latch types, series se
NTC Thermistor Sourcing: Lead Time Trends & Alternatives for 2026
NTC thermistor lead times are stretching again in 2026, especially automotive-grade parts. What's driving them, which specs matter, and what to qualify as a bac
What We Specify for IoT Devices: Connector and Interconnect Notes
Field notes from IoT BOM reviews: which 1.0–2.5 mm pitch connectors we pick for battery, sensor, and RF links — and which we reject.
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