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2,528,599 parts available to quote.
380LX682M016H012
CAP ALUM 6800UF 20% 16V SNAP
EDH108M050S9TAA
CAP ALUM 1000UF 20% 50V SMD
EGPA250ELL222MU25S
CAP ALUM 2200UF 20% 25V RADIAL
B41231C4189M000
CAP ALUM 18000UF 20% 16V SNAP
AFK337M25F24VT-F
CAP ALUM 330UF 20% 25V SMD
MAL213638331E3
CAP ALUM 330UF 20% 63V RADIAL
25TRV1500M16X16.5
CAP ALUM 1500UF 20% 25V SMD
UBT2G330MHD8TN
CAP ALUM 33UF 20% 400V RADIAL
380LQ123M016H022
CAP ALUM 12000UF 20% 16V SNAP
50USC2700MEFCSN20X30
CAP ALUM 2700UF 20% 50V SNAP
380LX221M200H012
CAP ALUM 220UF 20% 200V SNAP
338TMA025M
CAP ALUM 3300UF 20% 25V AXIAL
AFK477M06F24VT-F
CAP ALUM 470UF 20% 6.3V SMD
MAL213639151E3
CAP ALUM 150UF 20% 100V RADIAL
UPA1C392MHD
CAP ALUM 3900UF 20% 16V RADIAL
UCY2V680MHD6
CAP ALUM 68UF 20% 350V RADIAL
380LX681M100H012
CAP ALUM 680UF 20% 100V SNAP
MAL204830222E3
CAP ALUM 2200UF 20% 35V RADIAL
380LX562M025H012
CAP ALUM 5600UF 20% 25V SNAP
ESMG160ELL682MLN3S
CAP ALUM 6800UF 20% 16V RADIAL
AFK477M10F24VT-F
CAP ALUM 470UF 20% 10V SMD
MAL215050152E3
CAP ALUM 1500UF 20% 35V RADIAL
UPA0J822MHD
CAP ALUM 8200UF 20% 6.3V RADIAL
LLS2C391MELZ
CAP ALUM 390UF 20% 160V SNAP
381LX153M010H012
CAP ALUM 15000UF 20% 10V SNAP
MAL204834682E3
CAP ALUM 6800UF 20% 10V RADIAL
381LX102M063H012
CAP ALUM 1000UF 20% 63V SNAP
URZ2C151MHD
CAP ALUM 150UF 20% 160V RADIAL
AFK477M16F24VT-F
CAP ALUM 470UF 20% 16V SMD
MAL215055332E3
CAP ALUM 3300UF 20% 16V RADIAL
SLPX471M180A3P3
CAP ALUM 470UF 20% 180V SNAP
63ZL1000MEFC16X35.5
CAP ALUM 1000UF 20% 63V RADIAL
381LX562M025H012
CAP ALUM 5600UF 20% 25V SNAP
MAL204835472E3
CAP ALUM 4700UF 20% 16V RADIAL
381LX151M200H012
CAP ALUM 150UF 20% 200V SNAP
337BPA050M
CAP ALUM 330UF 20% 50V AXIAL
AFK687M10F24VT-F
CAP ALUM 680UF 20% 10V SMD
MAL215058681E3
CAP ALUM 680UF 20% 63V RADIAL
SLP153M016A7P3
CAP ALUM 15000UF 20% 16V SNAP
63ZL1000MEFCGC16X35.5
CAP ALUM 1000UF 20% 63V RADIAL
UBT2E470MHD
CAP ALUM 47UF 20% 250V RADIAL
MAL204836332E3
CAP ALUM 3300UF 20% 25V RADIAL
160TXW220MEFR10X60
CAP ALUM 220UF 20% 160V RAD TH
227LBA200M2CA
CAP ALUM 220UF 20% 200V SNAP
UPJ0J103MHD6
CAP ALUM 10000UF 20% 6.3V RADIAL
MAL215090105E3
CAP ALUM 1000UF 20% 35V RADIAL
SLPX182M080A3P3
CAP ALUM 1800UF 20% 80V SNAP
MAL202128221E3
CAP ALUM 220UF 20% 63V AXIAL
Industry News
Latest from electronics industry
Wafer-Level Burn-In for Improved WBG Device Reliability
Wafer-level burn-in screens SiC and GaN devices for infant mortality failures before packaging, improving module yields and reliability. The post Wafer-Level Burn-In for Improved WBG Device Reliability appeared first on Power Electronics News.
Microchip Achieves Key Milestones in PIC64-HPSC Spaceflight Computing Development
As spacecraft and satellites become more autonomous and rely on software to perform complex tasks, they need faster and more reliable onboard computing systems. These systems must also withstand harsh space conditions while maintaining security and dependable performance. Microchip Technology has announced several key developments in its PIC64-HPSC high-performance space computing series. The 64-bit multicore […] The post Microchip Achieves Key Milestones in PIC64-HPSC Spaceflight Computin
From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing
High-power impulse magnetron sputtering (HiPIMS) produces denser, better-adhering films than conventional sputtering, but scaling it to 200mm-plus substrates and inline production takes more than turning up the power. Authors from VON ARDENNE describe the engineering investment needed to move the technique from the lab into high-volume manufacturing. The post From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing appeared first on Semiconductor Digest.
Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography
Plasma dicing offers clear advantages over saw and laser singulation for thin wafers, hybrid bonding and HBM: throughput that doesn’t depend on die count, dicing streets as narrow as 5 µm and less mechanical stress. But bumps, copper pillars and cavities make it hard to protect the die surface during plasma etching, and conventional spin coating struggles to cover that topography. The post Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography appeared first
Advanced Packaging Process Control Through Full-Field Wafer Shape Using WFPI
Backside power delivery networks and HBM stacks depend on wafer bonding with tight pitches and overlay budgets, and even small bonding-induced distortions can turn into yield loss in downstream CMP, lithography and stacking. Traditional metrology often can’t deliver fast, full-wafer, non-destructive measurements at the speed high-volume manufacturing requires. The post Advanced Packaging Process Control Through Full-Field Wafer Shape Using WFPI appeared first on Semiconductor Digest.
“We’re Redefining Vehicular Security in Software Defined Vehicles” — R.V. Raghu, Director, Versatilist Consulting India
Beyond Physical Perimeters: Transitioning to Attack Surface Management With the rapid emergence of Software-Defined Vehicles (SDVs) and Advanced Driver Assistance Systems (ADAS), modern automobiles have evolved into distributed computing platforms—effectively data centres on wheels. This transformation requires a fundamental shift in how the industry conceptualises automotive security. Traditional security models relied on physical perimeters, drawing […] The post “We’re Redefining V
Industry Blog
Component guides, sourcing tips, and buying advice
What We Specify for Smart Home: Connectors Interconnects Notes
Field wiring, wire-to-board and outdoor connectors we specify for smart home designs — JST XH, Molex Micro-Fit 3.0, WAGO levers — with derating and lead-time no
Sourcing Connectors Interconnects Without Regret: A Field Guide
The connector that fails at 3 a.m. costs more than the connector. A field guide to the parameters that matter: current derating, plating, latch types, series se
NTC Thermistor Sourcing: Lead Time Trends & Alternatives for 2026
NTC thermistor lead times are stretching again in 2026, especially automotive-grade parts. What's driving them, which specs matter, and what to qualify as a bac
What We Specify for IoT Devices: Connector and Interconnect Notes
Field notes from IoT BOM reviews: which 1.0–2.5 mm pitch connectors we pick for battery, sensor, and RF links — and which we reject.
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