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380LX682M016H012
CAP ALUM 6800UF 20% 16V SNAP
EDH108M050S9TAA
CAP ALUM 1000UF 20% 50V SMD
EGPA250ELL222MU25S
CAP ALUM 2200UF 20% 25V RADIAL
B41231C4189M000
CAP ALUM 18000UF 20% 16V SNAP
AFK337M25F24VT-F
CAP ALUM 330UF 20% 25V SMD
MAL213638331E3
CAP ALUM 330UF 20% 63V RADIAL
25TRV1500M16X16.5
CAP ALUM 1500UF 20% 25V SMD
UBT2G330MHD8TN
CAP ALUM 33UF 20% 400V RADIAL
380LQ123M016H022
CAP ALUM 12000UF 20% 16V SNAP
50USC2700MEFCSN20X30
CAP ALUM 2700UF 20% 50V SNAP
380LX221M200H012
CAP ALUM 220UF 20% 200V SNAP
338TMA025M
CAP ALUM 3300UF 20% 25V AXIAL
AFK477M06F24VT-F
CAP ALUM 470UF 20% 6.3V SMD
MAL213639151E3
CAP ALUM 150UF 20% 100V RADIAL
UPA1C392MHD
CAP ALUM 3900UF 20% 16V RADIAL
UCY2V680MHD6
CAP ALUM 68UF 20% 350V RADIAL
380LX681M100H012
CAP ALUM 680UF 20% 100V SNAP
MAL204830222E3
CAP ALUM 2200UF 20% 35V RADIAL
380LX562M025H012
CAP ALUM 5600UF 20% 25V SNAP
ESMG160ELL682MLN3S
CAP ALUM 6800UF 20% 16V RADIAL
AFK477M10F24VT-F
CAP ALUM 470UF 20% 10V SMD
MAL215050152E3
CAP ALUM 1500UF 20% 35V RADIAL
UPA0J822MHD
CAP ALUM 8200UF 20% 6.3V RADIAL
LLS2C391MELZ
CAP ALUM 390UF 20% 160V SNAP
381LX153M010H012
CAP ALUM 15000UF 20% 10V SNAP
MAL204834682E3
CAP ALUM 6800UF 20% 10V RADIAL
381LX102M063H012
CAP ALUM 1000UF 20% 63V SNAP
URZ2C151MHD
CAP ALUM 150UF 20% 160V RADIAL
AFK477M16F24VT-F
CAP ALUM 470UF 20% 16V SMD
MAL215055332E3
CAP ALUM 3300UF 20% 16V RADIAL
SLPX471M180A3P3
CAP ALUM 470UF 20% 180V SNAP
63ZL1000MEFC16X35.5
CAP ALUM 1000UF 20% 63V RADIAL
381LX562M025H012
CAP ALUM 5600UF 20% 25V SNAP
MAL204835472E3
CAP ALUM 4700UF 20% 16V RADIAL
381LX151M200H012
CAP ALUM 150UF 20% 200V SNAP
337BPA050M
CAP ALUM 330UF 20% 50V AXIAL
AFK687M10F24VT-F
CAP ALUM 680UF 20% 10V SMD
MAL215058681E3
CAP ALUM 680UF 20% 63V RADIAL
SLP153M016A7P3
CAP ALUM 15000UF 20% 16V SNAP
63ZL1000MEFCGC16X35.5
CAP ALUM 1000UF 20% 63V RADIAL
UBT2E470MHD
CAP ALUM 47UF 20% 250V RADIAL
MAL204836332E3
CAP ALUM 3300UF 20% 25V RADIAL
160TXW220MEFR10X60
CAP ALUM 220UF 20% 160V RAD TH
227LBA200M2CA
CAP ALUM 220UF 20% 200V SNAP
UPJ0J103MHD6
CAP ALUM 10000UF 20% 6.3V RADIAL
MAL215090105E3
CAP ALUM 1000UF 20% 35V RADIAL
SLPX182M080A3P3
CAP ALUM 1800UF 20% 80V SNAP
MAL202128221E3
CAP ALUM 220UF 20% 63V AXIAL
Industry News
Latest from electronics industry
What’s in the November/December 2026 Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue. If you are attending SEMICON Europa, pick up an issue in print at the Tech Arena. The post What’s in the November/December 2026 Issue? appeared first on Semiconductor Digest.
Nordic Launches nRF71 SoCs for Low-Power Wi-Fi and Edge AI
Nordic Semiconductor has introduced the nRF71 series, a family of ultra-low-power system-on-chips (SoCs) that combine Wi-Fi, Bluetooth Low Energy (LE), Thread, and edge AI capabilities in a single device. Designed for battery-powered connected products, the new platform delivers up to 20 times lower standby power consumption than the previous-generation nRF70 Series Wi-Fi products. The nRF71 [...] The post Nordic Launches nRF71 SoCs for Low-Power Wi-Fi and Edge AI appeared first on Embedded.
Bosch Establishes Dedicated Semiconductor Division to Strengthen Chip Business
Effective January 1, 2028, Bosch will transfer its semiconductor operations to a new division called Semiconductors. The business will continue to be assigned to the Mobility business sector. Bosch’s semiconductor operations are currently part of its Mobility Electronics division. The post Bosch Establishes Dedicated Semiconductor Division to Strengthen Chip Business appeared first on Semiconductor Digest.
Entegris Enters Silicon Carbide and Diamond-Enabled Thermal Management Materials Market for AI Advanced Packaging
Entegris, Inc. today announced two important milestones in its strategic expansion into the market for silicon carbide (SiC) and diamond-enabled thermal management materials solutions for next-generation AI advanced packaging. The post Entegris Enters Silicon Carbide and Diamond-Enabled Thermal Management Materials Market for AI Advanced Packaging appeared first on Semiconductor Digest.
ACM Research Announces Shipment of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production Tool
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the shipment of its first 310 × 310 mm Ultra ECP ap-p panel-level horizontal electroplating production system to a customer in Asia outside mainland China. The post ACM Research Announces Shipment of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production Tool appeared first on Semiconductor Digest.
Tower Semiconductor and Innolight Advance High-Performance Near-Package Optics for AI Infrastructure
Leveraging Tower's 200mm and 300mm Silicon Photonics platforms, the collaboration supports multiple generations of Near-Packaged Optics development for AI infrastructure. The post Tower Semiconductor and Innolight Advance High-Performance Near-Package Optics for AI Infrastructure appeared first on Semiconductor Digest.
Industry Blog
Component guides, sourcing tips, and buying advice
Before You Buy Connectors Interconnects: The Checklist We Use Internally
The five-point checklist we run before every connector purchase — derating, plating, mating cycles, IP ratings, supply chain — with real part examples and price
What We Specify for Smart Home: Connectors Interconnects Notes
Field wiring, wire-to-board and outdoor connectors we specify for smart home designs — JST XH, Molex Micro-Fit 3.0, WAGO levers — with derating and lead-time no
Sourcing Connectors Interconnects Without Regret: A Field Guide
The connector that fails at 3 a.m. costs more than the connector. A field guide to the parameters that matter: current derating, plating, latch types, series se
NTC Thermistor Sourcing: Lead Time Trends & Alternatives for 2026
NTC thermistor lead times are stretching again in 2026, especially automotive-grade parts. What's driving them, which specs matter, and what to qualify as a bac
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