WeEn Strengthens Solid-State Transformer Portfolio

WeEn Semiconductors has expanded its silicon carbide (SiC) power module portfolio with the WMSC family, a series of high-voltage AC/DC and DC/DC modules developed for solid-state transformers (SSTs), high-power EV charging infrastructure and smart grid applications. The new product range includes more than 20 module variants at launch, offering blocking voltages from 1,200 V to 2,300 V and addressing the increasing demand for high-efficiency power conversion in next-generation electrical infrastructure.

Solid-state transformers are emerging as an alternative to conventional transformer technology, replacing low-frequency magnetic conversion with power electronic stages based on wide-bandgap semiconductors. This architecture enables conversion efficiencies approaching 98% while reducing system size and improving power density. The WMSC family is intended to support these designs by providing SiC power modules optimized for both AC/DC front-end conversion and isolated DC/DC stages.

The portfolio includes devices with on-resistance values as low as 1.5 mΩ and is available in multiple package options to accommodate different power levels and thermal requirements. In addition to standard products, WeEn offers customized module configurations to meet application-specific electrical and mechanical requirements.

For power factor correction (PFC) stages used in SST architectures, the company offers both three-level and two-level module topologies. Three-level configurations are intended to improve electromagnetic interference (EMI) performance while reducing switching stress, whereas two-level modules provide a simpler control architecture and a more compact implementation. One target application is grid-connected AI data center infrastructure, where the modules enable single-stage conversion from 35 kVAC distribution networks to an 800 VDC intermediate bus.

The product family also includes half-bridge modules for LLC resonant and dual-active-bridge (DAB) converters used in isolated DC/DC stages. These devices are available in several mechanical formats, including B2, B3, and 62 mm screw-mount packages, providing flexibility for different converter architectures.

All WMSC modules feature low parasitic inductance to support high-speed SiC switching while simplifying PCB layout and system integration. The pin configuration has been optimized to facilitate gate-driver placement while maintaining electrical isolation and meeting safety requirements. Additional customization options include direct-bonded copper substrates, housing materials, silicone gel encapsulation, terminal configurations, plating finishes, and pre-applied thermal interface materials.

The WMSC family is available immediately for engineering samples and volume production, providing designers with a broad range of SiC power modules for high-voltage power conversion systems in AI infrastructure, renewable energy, industrial power electronics and ultra-fast EV charging applications.

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