Flex Power Modules Launches BMR353 Eighth-Brick IBC

Flex Power Modules has expanded its portfolio of power conversion solutions with the BMR353, a high-power DC/DC intermediate bus converter (IBC) developed to address the power density and efficiency requirements of AI data centers. The non-isolated eighth-brick module provides a regulated 12.2 V output from an input voltage range of 40 V to 60 V, delivering up to 860 W of continuous output power and supporting peak loads of 1,200 W.

The converter is designed to accommodate the rapidly changing power demands associated with AI training and inference workloads. Its 100 A peak output capability enables the module to respond to short-duration current transients while maintaining a stable intermediate bus voltage for downstream power distribution. In addition to supplying point-of-load converters, the regulated output can power storage systems, cooling infrastructure, and other auxiliary subsystems commonly deployed in AI server platforms.

Power conversion efficiency reaches up to 97.8% at a 54 V input and 50% load, reducing conversion losses and easing thermal management in high-density computing environments. The module occupies the standard eighth-brick form factor, measuring 58.4 × 22.7 mm with a 12.8 mm profile. Flex Power Modules has also optimized the baseplate design to improve heat dissipation while maintaining a low package height suitable for space-constrained server boards.

The BMR353 incorporates a PMBus interface that enables digital configuration and monitoring through the Flex Power Designer software environment. Engineers can access operating parameters, diagnostic information, and fault records, simplifying system integration and lifecycle management. The module also includes a range of protection mechanisms, such as monotonic startup, output overvoltage protection, overtemperature shutdown, and short-circuit protection, to improve operational reliability.

To support different manufacturing requirements, the converter is designed for through-hole mounting and is compatible with wave soldering, pin-in-paste reflow, and manual soldering processes. This flexibility allows the same module to be used in both prototype development and high-volume production.

The BMR353 is available immediately and targets AI data center applications that require high-efficiency intermediate-bus conversion, compact dimensions, and the ability to handle dynamic, high-current workloads.

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