Lotus Microsystems Unveils vStrata Vertical Power Delivery Platform

Lotus Microsystems has introduced vStrata, a vertical power delivery (VPD) platform developed to address the increasing power density and thermal management challenges of AI infrastructure. The first product based on the architecture, the LSC0580 module, is scheduled to enter engineering sampling in the third quarter of 2026 after successful tape-outs with multiple xPU and AI infrastructure partners.

As AI accelerators continue to require increasingly high current levels, conventional power delivery architectures are becoming constrained by distribution losses, thermal limitations, and mechanical integration challenges. Rather than addressing these factors independently, the vStrata platform combines electrical, thermal, and mechanical design into a single architecture intended to optimize power delivery directly beneath the processor.

The platform is built around Lotus Microsystems’ proprietary Power Interposer Technology (PIT), which integrates power conversion into a low-profile silicon-based structure positioned close to the processor. Reducing the electrical distance between the power stage and the compute device minimizes distribution losses while improving transient response. According to the company, the architecture supports load transients exceeding 10 A/ns without requiring external capacitors, an important capability for rapidly changing AI workloads.

Thermal management is another key aspect of the design. By using a high-thermal-conductivity silicon substrate, the platform removes heat at the point of load rather than relying solely on conventional board-level cooling. Lotus Microsystems states that optimized implementations can reduce hotspot temperatures by up to 25°C while decreasing power conversion losses by more than 50%, thereby improving overall system efficiency and reducing data center energy consumption.

The initial LSC0580 platform is designed to deliver point-of-load conversion efficiency of up to 96% while supporting kiloampere-class current requirements for next-generation AI processors. Its compact construction also contributes to higher compute density by reducing the space required for power-delivery components, thereby allowing more accelerator boards to be deployed within a server rack.

To simplify adoption, the module has been designed to be compatible with existing Tier-1 server reference platforms and standard power management controllers, minimizing changes to established system architectures.

Lotus Microsystems is currently working with several hyperscale customers through an Early Access Program and plans to expand collaboration with additional partners worldwide. Engineering samples of the LSC0580 are expected to become available during the third quarter of 2026.

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