508-AG10D-ES
CONN IC DIP SOCKET 8POS GOLD
Sockets For Ics Transistors
Bulk,Box
500
Active
$2.26 / unit (market reference)
MOQ: 60 pcs
Submit your quantity via the inquiry form for a competitive quote within 24 hours.
Parameters
| Parameter | Value |
|---|---|
| Brand | TE Connectivity AMP Connectors |
| Model | 508-AG10D-ES |
| Package / Case | Bulk,Box |
| Mounting Type | Through Hole |
| Operating Temperature | -55°C ~ 125°C |
| RoHS | RoHS |
| Part Status | Active |
Application & Notes
508-AG10D-ES by TE Connectivity AMP Connectors is an N-channel power MOSFET rated at N/A / N/A, commonly used in DC-DC converters, motor drivers, power supplies, and battery protection circuits. The Bulk,Box package offers good thermal performance for SMT mounting. Key spec: Rds(on) max N/A. Select gate driver voltage carefully — logic-level variants exist for direct MCU drive.
📖 Technical Guides for 508-AG10D-ES
Alternatives & Replacements
View All →2069965-3
CONN SOCKET LGA 1155POS GOLD
1-1571995-0
CONN SOCKET SIP 10POS TIN
1-1571995-2
CONN SOCKET SIP 12POS GOLD
XR2C-1611-N
CONN SOCKET SIP 16POS GOLD
XR2C-3205
CONN SOCKET SIP 32POS GOLD
XR2A-1625
CONN IC DIP SOCKET 16POS GOLD
All Technical Specifications
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Pitch - Mating | 0.100" (2.54mm) |
| Housing Material | Polyester |
| Contact Finish - Post | Gold |
| Contact Finish - Mating | Gold |
| Contact Material - Post | Copper Alloy |
| Contact Material - Mating | Copper Alloy |
| Contact Finish Thickness - Post | 25.0µin (0.63µm) |
| Contact Finish Thickness - Mating | 25.0µin (0.63µm) |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
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