
5G and RF Components: Filters, PAs, Antenna Switches Guide for Buyers

5G and RF Components: Filters, PAs, Antenna Switches, and Front-End Modules
5G demands new RF components — higher frequencies, wider bandwidths, and more antenna paths. Here's what's different about 5G RF, popular parts, and sourcing challenges.
Why 5G RF Is Different
5G adds two new frequency ranges that change the RF bill of materials:
| Feature | 4G LTE | 5G sub-6GHz | 5G mmWave |
| Frequency | 0.6-2.7 GHz | 3.3-5.0 GHz | 24-47 GHz |
| Bandwidth | 20 MHz | 100 MHz | 400 MHz |
| Antenna paths | 2-4 | 8-16 (MIMO) | 32+ (beamforming) |
| PA efficiency target | 40% | 45%+ | 15-25% (10dB backoff) |
| Filter type | SAW | BAW/TC-SAW | On-chip |
Key 5G RF Components
Power Amplifiers (PAs):
- GaAs HBT for sub-6GHz (Skyworks, Qorvo)
- GaN-on-SiC for mmWave base stations (more expensive but higher efficiency)
- Envelope tracking reduces PA power by 30-40% (Qualcomm, Qorvo)
Filters:
- SAW (Surface Acoustic Wave): Below 2.5 GHz, lower cost
- BAW (Bulk Acoustic Wave): 2.5-6 GHz, better rejection, more expensive
- TC-SAW (Temperature-Compensated SAW): Middle ground
Antenna Tuning:
- Aperture tuning switches can improve antenna efficiency by 2-4dB
- Key components: SP4T/SP8T RF switches, tunable capacitors
Popular 5G RF Parts
| Component | Part | Key Spec |
| Sub-6GHz PA | Qorvo QM77038 | n77/n78/n79 bands |
| mmWave beamformer | Anokiwave AWMF-0108 | 26-30 GHz |
| Antenna tuner | Skyworks SKY19247 | 0.7-2.7 GHz |
| BAW filter | Broadcom AFEM-S257 | n41 band (2.5 GHz) |
| RF switch | pSemi PE42524 | SP4T, 10W |
Chinese 5G RF Suppliers
- Maxscend (卓胜微) — RF switches and LNAs, dominant in Chinese smartphones
- Unisoc (紫光展锐) — 5G baseband chipsets
- Vanchip (唯捷创芯) — 4G/5G PAs, shipping to Samsung and Xiaomi
- Smarter Micro (广州慧智微) — Reconfigurable RF front-end, backed by Qualcomm
Sourcing 5G RF Components
Supply concentration: 80% of BAW filters come from Broadcom and Qorvo. Supply disruptions here impact every phone manufacturer.
Custom vs off-the-shelf: RF front-end modules are highly customized to specific phone models, making cross-reference near impossible. Plan for 12-18 month lifecycle, not 3-5 years.
Package evolution: RF SiP (System-in-Package) integrates PA + filter + switch + LNA in one module. More expensive per unit but reduces BOM complexity and PCB area.
Related Articles
- Wireless Connectivity Compared — Every protocol from BLE to 5G
- SiC vs GaN: Wide Bandgap Semiconductors for Power Electronics — GaN for RF and power
- IoT Module Selection Guide — Cellular and wireless modules
Need help sourcing these components?
PartsCube Global stocks all alternatives mentioned in this guide. Search our catalog or submit your BOM for a quote.
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