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Xilinx Inc.1760-BBGA, FCBGARoHS

XCZU19EG-2FFVD1760I

IC SOC CORTEX-A53 1760FCBGA

Subcategory

Embedded System On Chip Soc

Package

1760-BBGA, FCBGA

Series

Zynq® UltraScale+™ MPSoC EG

Status

Active

$10410.72 / unit (market reference)

MOQ: 1 pcs

Submit your quantity via the inquiry form for a competitive quote within 24 hours.

Parameters

ParameterValue
BrandXilinx Inc.
ModelXCZU19EG-2FFVD1760I
Package / Case1760-BBGA, FCBGA
Operating Temperature-40°C ~ 100°C (TJ)
SeriesZynq® UltraScale+™ MPSoC EG
Supplier Device Package1760-FCBGA (42.5x42.5)
RoHSRoHS
Part StatusActive

Application & Notes

XCZU19EG-2FFVD1760I by Xilinx Inc. is a commonly used electronic component in the Embedded System On Chip Soc category. Available in 1760-BBGA, FCBGA package with -40°C ~ 100°C (TJ) operating temperature range. Contact us for datasheet, pricing, and availability.

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All Technical Specifications

Speed533MHz, 600MHz, 1.3GHz
RAM Size256KB
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary AttributesZynq®UltraScale+™ FPGA, 1143K+ Logic Cells

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