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Xilinx Inc.1760-BFBGA, FCBGARoHS

XCVC1902-1MSEVSVD1760

IC VERSAL AICORE FPGA 1760BGA

Subcategory

Embedded System On Chip Soc

Package

1760-BFBGA, FCBGA

Series

Versal™ AI Core

Status

Active

$22550.82 / unit (market reference)

MOQ: 1 pcs

Submit your quantity via the inquiry form for a competitive quote within 24 hours.

Parameters

ParameterValue
BrandXilinx Inc.
ModelXCVC1902-1MSEVSVD1760
Package / Case1760-BFBGA, FCBGA
Operating Temperature0°C ~ 100°C (TJ)
SeriesVersal™ AI Core
Supplier Device Package1760-FCBGA (40x40)
RoHSRoHS
Part StatusActive

Application & Notes

XCVC1902-1MSEVSVD1760 by Xilinx Inc. is a commonly used electronic component in the Embedded System On Chip Soc category. Available in 1760-BFBGA, FCBGA package with 0°C ~ 100°C (TJ) operating temperature range. Contact us for datasheet, pricing, and availability.

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All Technical Specifications

Speed600MHz, 1.3GHz
RAM Size256KB
PeripheralsDDR, DMA, PCIe
ArchitectureMPU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ AI Core FPGA, 1.9M Logic Cells

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