Chip Quik Inc.BulkRoHS
TS991SNL35T3
THERMALLY STABLE SOLDER PASTE NC
Subcategory
Solder
Package
Bulk
Series
CHIPQUIK®
Status
Active
$43.61 / unit (market reference)
MOQ: 1 pcs
Submit your quantity via the inquiry form for a competitive quote within 24 hours.
Parameters
| Parameter | Value |
|---|---|
| Brand | Chip Quik Inc. |
| Model | TS991SNL35T3 |
| Package / Case | Bulk |
| Series | CHIPQUIK® |
| RoHS | RoHS |
| Part Status | Active |
Application & Notes
TS991SNL35T3 by Chip Quik Inc. is a commonly used electronic component in the Solder category. Available in Bulk package with standard temperature range operating temperature range. Contact us for datasheet, pricing, and availability.
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All Technical Specifications
| Form | Syringe, 1.23 oz (34.869g) |
| Type | Solder Paste |
| Flux Type | No-Clean |
| Mesh Type | 3 |
| Shelf Life | 12 Months |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Melting Point | 423°F (217°C) |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
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