NXP USA Inc.416-BGARoHS
SPC5775BDK3MME2
IC MCU 32BIT 4MB FLASH 416MAPBGA
Category
Subcategory
Embedded Microcontrollers
Package
416-BGA
Series
MPC57xx
Status
Active
$53.71 / unit (market reference)
MOQ: 1 pcs
Submit your quantity via the inquiry form for a competitive quote within 24 hours.
Parameters
| Parameter | Value |
|---|---|
| Brand | NXP USA Inc. |
| Model | SPC5775BDK3MME2 |
| Package / Case | 416-BGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Core Processor | e200z7 |
| Speed | 220MHz |
| Program Memory Size | 4MB (4M x 8) |
| RAM Size | 512K x 8 |
| Number of I/O | 293 |
| Data Converters | A/D 40x12b eQADCx2 |
| Voltage - Supply | 3V ~ 5.5V |
| Connectivity | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI |
| Peripherals | DMA, LVD, POR, Zipwire |
| Supplier Device Package | 416-MAPBGA (27x27) |
| RoHS | RoHS |
| Part Status | Active |
Application & Notes
SPC5775BDK3MME2 by NXP USA Inc. is a e200z7 microcontroller widely used in industrial control, motor drives, IoT devices, 3D printer mainboards, and consumer electronics. The 416-BGA package fits automated SMT assembly. Operating temperature is -40°C ~ 125°C (TA) — verify your application environment. Pin-compatible domestic alternatives include GigaDevice GD32 series and Artery AT32 series — note GD32 ADC specs may differ slightly from ST originals.
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All Technical Specifications
| Speed | 220MHz |
| RAM Size | 512K x 8 |
| Core Size | 32-Bit Dual-Core |
| Peripherals | DMA, LVD, POR, Zipwire |
| Connectivity | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI |
| Number of I/O | 293 |
| Core Processor | e200z7 |
| Data Converters | A/D 40x12b eQADCx2 |
| Oscillator Type | External |
| Program Memory Size | 4MB (4M x 8) |
| Program Memory Type | FLASH |
| Voltage - Supply (Vcc/Vdd) | 3V ~ 5.5V |
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