Chip Quik Inc.JarRoHS
SMDLTLFP250T4
SOLDER PASTE LOW TEMP T4 250G
Subcategory
Solder
Package
Jar
Status
Active
$83.95 / unit (market reference)
MOQ: 1 pcs
Submit your quantity via the inquiry form for a competitive quote within 24 hours.
Parameters
| Parameter | Value |
|---|---|
| Brand | Chip Quik Inc. |
| Model | SMDLTLFP250T4 |
| Package / Case | Jar |
| RoHS | RoHS |
| Part Status | Active |
Application & Notes
SMDLTLFP250T4 by Chip Quik Inc. is a commonly used electronic component in the Solder category. Available in Jar package with standard temperature range operating temperature range. Contact us for datasheet, pricing, and availability.
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All Technical Specifications
| Form | Jar, 8.8 oz (250g) |
| Type | Solder Paste |
| Process | Lead Free |
| Flux Type | No-Clean |
| Mesh Type | 4 |
| Shelf Life | 6 Months |
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Melting Point | 281°F (138°C) |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
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