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Silicon Motion, Inc.153-TFBGARoHS

SM662PAD-BDSS

FERRI-EMMC 3D 40GB SLC 153BGA

Subcategory

Memory

Package

153-TFBGA

Series

Ferri-eMMC®

Status

Obsolete

Price available on request

MOQ: 1 pcs

Submit your quantity via the inquiry form for a competitive quote within 24 hours.

Parameters

ParameterValue
BrandSilicon Motion, Inc.
ModelSM662PAD-BDSS
Package / Case153-TFBGA
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 105°C
SeriesFerri-eMMC®
Supplier Device Package153-BGA (11.5x13)
RoHSRoHS
Part StatusObsolete

Application & Notes

SM662PAD-BDSS by Silicon Motion, Inc. is a commonly used electronic component in the Memory category. Available in 153-TFBGA package with -40°C ~ 105°C operating temperature range. Contact us for datasheet, pricing, and availability.

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All Technical Specifications

TechnologyFLASH - NAND (SLC), FLASH - NAND (TLC)
Memory Size320Gb (40G x 8)
Memory TypeNon-Volatile
Memory FormatFLASH
Memory InterfaceeMMC

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