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Epson Electronics America Inc-Semiconductor DivDieRoHS

S1C17W15D001000

IC MCU 16BIT 64KB FLASH DIE

Subcategory

Embedded Microcontrollers

Package

Die

Series

S1C17W

Status

Active

$1.61 / unit (market reference)

MOQ: 1620 pcs

Submit your quantity via the inquiry form for a competitive quote within 24 hours.

Parameters

ParameterValue
BrandEpson Electronics America Inc-Semiconductor Div
ModelS1C17W15D001000
Package / CaseDie
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C (TA)
Core ProcessorS1C17
Speed4.2MHz
Program Memory Size64KB (64K x 8)
RAM Size4K x 8
Number of I/O35
Voltage - Supply1.2V ~ 3.6V
ConnectivityI²C, IrDA, SPI, UART/USART
PeripheralsLCD, POR, PWM, RFC, SNDA, WDT
Supplier Device PackageDie
RoHSRoHS
Part StatusActive

Application & Notes

S1C17W15D001000 by Epson Electronics America Inc-Semiconductor Div is a S1C17 microcontroller widely used in industrial control, motor drives, IoT devices, 3D printer mainboards, and consumer electronics. The Die package fits automated SMT assembly. Operating temperature is -40°C ~ 85°C (TA) — verify your application environment. Pin-compatible domestic alternatives include GigaDevice GD32 series and Artery AT32 series — note GD32 ADC specs may differ slightly from ST originals.

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All Technical Specifications

Speed4.2MHz
RAM Size4K x 8
Core Size16-Bit
PeripheralsLCD, POR, PWM, RFC, SNDA, WDT
ConnectivityI²C, IrDA, SPI, UART/USART
Number of I/O35
Core ProcessorS1C17
Oscillator TypeInternal
Program Memory Size64KB (64K x 8)
Program Memory TypeFLASH
Voltage - Supply (Vcc/Vdd)1.2V ~ 3.6V

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