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Epson Electronics America Inc-Semiconductor DivDieRoHS

S1C17F57D402000

IC MCU 16BIT 32KB FLASH DIE

Subcategory

Embedded Microcontrollers

Package

Die

Status

Obsolete

Price available on request

MOQ: 1 pcs

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Parameters

ParameterValue
BrandEpson Electronics America Inc-Semiconductor Div
ModelS1C17F57D402000
Package / CaseDie
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C (TA)
Core ProcessorS1C17
Speed4.2MHz
Program Memory Size32KB (32K x 8)
RAM Size2K x 8
Number of I/O29
Voltage - Supply2V ~ 3.6V
ConnectivityI²C, IrDA, SPI, UART/USART
PeripheralsPWM, WDT
RoHSRoHS
Part StatusObsolete

Application & Notes

S1C17F57D402000 by Epson Electronics America Inc-Semiconductor Div is a S1C17 microcontroller widely used in industrial control, motor drives, IoT devices, 3D printer mainboards, and consumer electronics. The Die package fits automated SMT assembly. Operating temperature is -40°C ~ 85°C (TA) — verify your application environment. Pin-compatible domestic alternatives include GigaDevice GD32 series and Artery AT32 series — note GD32 ADC specs may differ slightly from ST originals.

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All Technical Specifications

Speed4.2MHz
RAM Size2K x 8
Core Size16-Bit
PeripheralsPWM, WDT
ConnectivityI²C, IrDA, SPI, UART/USART
Number of I/O29
Core ProcessorS1C17
Oscillator TypeInternal
Program Memory Size32KB (32K x 8)
Program Memory TypeFLASH
Voltage - Supply (Vcc/Vdd)2V ~ 3.6V

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