Epson Electronics America Inc-Semiconductor DivDieRoHS
S1C17F57D402000
IC MCU 16BIT 32KB FLASH DIE
Category
Subcategory
Embedded Microcontrollers
Package
Die
Status
Obsolete
Price available on request
MOQ: 1 pcs
Submit your quantity via the inquiry form for a competitive quote within 24 hours.
Parameters
| Parameter | Value |
|---|---|
| Brand | Epson Electronics America Inc-Semiconductor Div |
| Model | S1C17F57D402000 |
| Package / Case | Die |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Core Processor | S1C17 |
| Speed | 4.2MHz |
| Program Memory Size | 32KB (32K x 8) |
| RAM Size | 2K x 8 |
| Number of I/O | 29 |
| Voltage - Supply | 2V ~ 3.6V |
| Connectivity | I²C, IrDA, SPI, UART/USART |
| Peripherals | PWM, WDT |
| RoHS | RoHS |
| Part Status | Obsolete |
Application & Notes
S1C17F57D402000 by Epson Electronics America Inc-Semiconductor Div is a S1C17 microcontroller widely used in industrial control, motor drives, IoT devices, 3D printer mainboards, and consumer electronics. The Die package fits automated SMT assembly. Operating temperature is -40°C ~ 85°C (TA) — verify your application environment. Pin-compatible domestic alternatives include GigaDevice GD32 series and Artery AT32 series — note GD32 ADC specs may differ slightly from ST originals.
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All Technical Specifications
| Speed | 4.2MHz |
| RAM Size | 2K x 8 |
| Core Size | 16-Bit |
| Peripherals | PWM, WDT |
| Connectivity | I²C, IrDA, SPI, UART/USART |
| Number of I/O | 29 |
| Core Processor | S1C17 |
| Oscillator Type | Internal |
| Program Memory Size | 32KB (32K x 8) |
| Program Memory Type | FLASH |
| Voltage - Supply (Vcc/Vdd) | 2V ~ 3.6V |
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