CUI DevicesBoxRoHS
HSB07-202009
HEAT SINK, BGA, 20 X 20 X 9 MM
Category
Subcategory
Thermal Heat Sinks
Package
Box
Series
HSB
Status
Active
$0.58 / unit (market reference)
MOQ: 1872 pcs
Submit your quantity via the inquiry form for a competitive quote within 24 hours.
Parameters
| Parameter | Value |
|---|---|
| Brand | CUI Devices |
| Model | HSB07-202009 |
| Package / Case | Box |
| Series | HSB |
| RoHS | RoHS |
| Part Status | Active |
Application & Notes
HSB07-202009 by CUI Devices is a commonly used electronic component in the Thermal Heat Sinks category. Available in Box package with standard temperature range operating temperature range. Contact us for datasheet, pricing, and availability.
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All Technical Specifications
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.787" (20.00mm) |
| Length | 0.787" (20.00mm) |
| Material | Aluminum Alloy |
| Fin Height | 0.354" (9.00mm) |
| Package Cooled | BGA |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 24.08°C/W |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 8.60°C/W @ 200 LFM |
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