CUI DevicesBoxRoHS
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Category
Subcategory
Thermal Heat Sinks
Package
Box
Series
HSB
Status
Active
$0.51 / unit (market reference)
MOQ: 3672 pcs
Submit your quantity via the inquiry form for a competitive quote within 24 hours.
Parameters
| Parameter | Value |
|---|---|
| Brand | CUI Devices |
| Model | HSB01-080808 |
| Package / Case | Box |
| Series | HSB |
| RoHS | RoHS |
| Part Status | Active |
Application & Notes
HSB01-080808 by CUI Devices is a commonly used electronic component in the Thermal Heat Sinks category. Available in Box package with standard temperature range operating temperature range. Contact us for datasheet, pricing, and availability.
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All Technical Specifications
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.335" (8.50mm) |
| Length | 0.335" (8.50mm) |
| Material | Aluminum Alloy |
| Fin Height | 0.315" (8.00mm) |
| Package Cooled | BGA |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 39.10°C/W |
| Power Dissipation @ Temperature Rise | 1.9W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 16.00°C/W @ 200 LFM |
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