CTS Thermal Management ProductsBoxRoHS
BDN09-3CB
HEATSINK CPU .91" SQ
Category
Subcategory
Thermal Heat Sinks
Package
Box
Series
BDN
Status
Active
$1.80 / unit (market reference)
MOQ: 1 pcs
Submit your quantity via the inquiry form for a competitive quote within 24 hours.
Parameters
| Parameter | Value |
|---|---|
| Brand | CTS Thermal Management Products |
| Model | BDN09-3CB |
| Package / Case | Box |
| Series | BDN |
| RoHS | RoHS |
| Part Status | Active |
Application & Notes
BDN09-3CB by CTS Thermal Management Products is a commonly used electronic component in the Thermal Heat Sinks category. Available in Box package with standard temperature range operating temperature range. Contact us for datasheet, pricing, and availability.
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All Technical Specifications
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.910" (23.11mm) |
| Length | 0.910" (23.11mm) |
| Material | Aluminum |
| Fin Height | 0.355" (9.02mm) |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Material Finish | Black Anodized |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Thermal Resistance @ Natural | 26.90°C/W |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 400 LFM |
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