ViTrox Reports Nearly 200 AI-Powered X-Ray Inspection Systems Deployed

ViTrox is participating in SEMICON Europa 2026, taking place at the Trade Fair Centre Messe München, Munich, Germany, from 10th to 13th November 2026. At Hall C2, Booth #174, visitors can witness how ViTrox’s AI-driven 3D AOI, 3D AXI, and manufacturing intelligence solutions empower European manufacturers to detect hidden defects, reduce programming time, and lower inspection costs.

As European manufacturers scale up advanced packaging, heterogeneous integration, and high-density SMT processes, defects are becoming smaller, more deeply embedded, and increasingly difficult to detect using conventional inspection methods. In line with SEMICON Europa 2026’s theme of global collaboration for European economic resilience, ViTrox’s booth will address a critical question facing production teams today: how to reliably detect these defects at line speed, without driving up costs or adding engineering headcount.

Featured AI-Driven Technologies at Hall C2, Booth #174

ViTrox will demonstrate a curated line-up of its flagship AI-driven inspection technologies, spanning front-end SMT assembly through to back-end semiconductor and advanced packaging:

Smart 3D AOI System V510Ai ST — Engineered for high-performance front-end PCBA SMT inspection, the V510Ai ST delivers rapid, high-precision inspection of large PCBs up to 600 × 510 mm. It combines true 3D measurement with AI Smart Programming and inspection speeds of up to 64 cm/sec, while camera-read barcode scanning and OCR with batch code logging provide complete board- and component-level traceability.
Smart 3D AOI System V510Ai Vision Pro — Empowered by auxiliary SWIR vision, high-resolution imaging, and AI-powered inspection to detect inner die cracks beyond the visible spectrum. With integrated HEPA filtration, the system supports cleanroom manufacturing requirements while delivering reliable inspection performance in demanding applications.
Smart 3D AXI System V810Ai QX1 — An award-winning, AI-powered automated X-ray inspection machine built for advanced packaging challenges such as Flip Chip and System-in-Package (SiP) applications. With 2 μm resolution, ±50° tomography, AI-based defect classification, and an optional dual-lane configuration, V810Ai QX1 is engineered to deliver high-throughput inspection of complex boards with reliable micro-defect detection. Nearly 200 units have been deployed within one year across major global AI-server manufacturers, demonstrating strong market traction and industry adoption.

These solutions are all connected to ViTrox’s Manufacturing Intelligence Solutions Towards Industry 5.0 (V-ONE). Through powerful data modules such as ONE View, which enables upstream cross-referencing of real-time images at buy-off stations, and Process Insight, which triggers auto-ticketing and comprehensive root-cause analysis whenever defect conditions are detected, the ecosystem ensures seamless data connectivity and true closed-loop control. This integration ultimately empowers manufacturers to reduce human error, detect defects earlier, optimise process performance, and maintain consistent product quality across every stage of production.

Together, these solutions reflect ViTrox’s commitment to building connected, intelligent ecosystems where precision, operational efficiency, and AI work seamlessly to empower modern smart factories.

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