Teledyne Vision Solutions Demonstrates Single-Pass 300mm Wafer Inspection

Teledyne Vision Solutions showcases advanced imaging technologies for semiconductor inspection at SEMICON Europa 2026, taking place November 10-13, 2026, at Messe München in Munich, Germany. Visitors can see live demonstrations of the Linea ML 32K line scan camera and Z3 3D Measurement System in Hall C2, Stand 136.

The Linea ML 32K demonstration will show how a 300mm semiconductor wafer can be inspected in a single pass at 10 µm resolution. As the world’s first true 32K line scan camera, Linea ML 32K combines 32K resolution, 2.5 µm pixels, and imaging speeds of up to 150 kHz to deliver exceptional image quality and defect detection performance. Built on Teledyne’s proven Linea platform, the camera also supports advanced imaging modes, including multiline operation, HDR, and TDI, helping manufacturers improve inspection confidence while simplifying integration into existing systems.

Teledyne will also demonstrate the Z3 3D Measurement System, which combines high-resolution 3D measurement and 2D imaging for precision inspection and metrology. With up to 1.25 µm spatial resolution, up to 35nm height repeatability, and throughput of up to two seconds per wafer, the Z3 supports demanding semiconductor inspection and measurement applications at in-line speeds. Designed to support the leading-edge AI hardware needs, the latest 3D measurement system supports micro BGA, bump and pillar metrology on die, wafer, or stretch frame, as well as TGV/TSV, wafer inspection, wafer-to-wafer bonding, flatness, coplanarity, and defect analysis. The Z3 delivers detailed surface and dimensional measurements to support process control and quality assurance.

Visitors are invited to stop by Hall C2, Stand 136 to speak with Teledyne imaging specialists and learn more about the company’s solutions for semiconductor inspection and measurement.

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