Technic Showcases Copper Plating Chemistries for Advanced Packaging

Technic will participate in SEMICON Europa 2026, taking place November 10–13, 2026, at Messe München in Munich, Germany.

Co-located with electronica, SEMICON Europa brings together semiconductor manufacturers, technology leaders, engineers, and suppliers from across the global electronics industry. Under this year’s theme, “Europe’s Next Era: Navigating the Perfect Storm,” the event will explore the technologies, partnerships, and strategies shaping the future of semiconductor manufacturing in Europe and beyond.

Technic supplies advanced solutions for semiconductor fabrication and packaging, combining high-performance process chemistries with precision plating systems designed to meet the evolving requirements of advanced packaging, IC substrates, power devices, MEMS, and wafer-level applications.

Technic’s Elevate processes provide high-performance electroplating solutions for copper, nickel, tin, and precious metals. Among the latest additions to the portfolio, Elevate® Cu 3000 and Elevate® Cu 1500 support 2.5D and 3D integration and the high-density interconnects required for AI and other next-generation semiconductor applications. Elevate Cu 3000 delivers flexible feature profiles and excellent coplanarity across a wide current density range, while Elevate Cu 1500 provides outstanding via-fill capability and surface leveling for high-reliability interconnects.

With decades of wet-process expertise, Technic also provides advanced photoresist strippers, metal etchants, and cleaning solutions engineered for precise material removal and surface preparation while preserving device integrity. Through ongoing research, development, and collaborative projects, Technic continues to advance safer and more sustainable chemistries that reduce environmental impact while supporting the performance requirements of next-generation semiconductor manufacturing.

Visit Technic at Booth #B1361 to meet our team and explore our latest electroplating chemistries, surface preparation solutions, and semiconductor process technologies designed to improve performance, reliability, and manufacturing efficiency.

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