UCIe Connectivity for 2.5D and 3D Multi-Die Designs
UCIe provides a common standard for die-to-die connectivity, but connecting dies in a 2.5D package is fundamentally different from connecting them in a 3D design.
In 2.5D designs, UCIe links traverse package channels where insertion loss, crosstalk, and increasing data rates influence PHY and package design. In 3D designs, shorter vertical connections and fine-pitch bonding allow bandwidth to scale through connection density, reducing the need for high-speed serialization, equalization, and channel training.
This white paper examines those differences and the engineering considerations behind choosing and implementing UCIe connectivity for advanced multi-die designs.
What you’ll learn:
- How UCIe connectivity differs across 2.5D and 3D designs
- How F2B and F2F topologies affect interface design
- How 3D integration changes implementation, test, and reliability requirements
- How to align UCIe IP, package topology, and implementation strategy
Read more here.
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