Nordson Electronics Solutions Wins The 2026 Global Technology Award for the MARCH ExoSPHERE Plasma Treatment System

Nordson Electronics Solutions accepted the 2026 Global Technology Award in the  Plasma Systems category for their new, MARCH ExoSPHERE plasma treatment system.

Innovative plasma treatment platform for panel-level packaging

The MARCH ExoSPHERE system applies plasma treatment to clean and enhance surfaces for adhesion to improve reliability and yields. The system is designed for panel-level packaging (PLP), an emerging technique fulfilling demands for next-generation AI and HPC semiconductor manufacturing. The ExoSPHERE system enables void-free underfilling and increased wicking speeds while improving yields with reduced rework and rejected parts. Its industry-leading plasma uniformity and process repeatability effectively remove contaminants while enhancing surface energy, resulting in improved resist wettability, stronger die attach and wire bond integrity, and more robust package performance.

Key features of the MARCH ExoSPHERE™ plasma system

• Patented three-axis symmetrical chamber ensures consistent, uniform plasma treatment on panels up to 650x650mm.
• Integrated handlers accommodate panels, wafers, and carriers, adapting for warpage. Software-controlled change-over minimizes transition time to different panel or wafer sizes.
• ExoSPHERE’s SMART Tune™ Management System delivers closed-loop plasma control, optimizing the RF system, reducing tuning time. Automatically resets to plasma-ready state, adjusting for variations in vacuum pressure, temperature, and lot sizes.
• The system achieves maximum power in seconds, using proprietary algorithms that continuously measure both forward and reflective power inside the plasma chamber. The compact chamber volume with process control ensures short cycle times, reduces electricity demand.

Plasma treatment for a range of advanced packaging

“This award reflects the industry’s need for plasma treatment solutions in PLP packaging that support increasingly complex advanced packaging applications,” said Johnson He, senior principal product line manager. “ExoSPHERE was designed to help customers improve process consistency, package reliability, and overall manufacturing efficiency.”

For this award, the MARCH ExoSPHERE plasma system was judged in seven criteria:  innovation, throughput improvements, quality contributions, cost benefits, environmental considerations, ease of use, and maintainability.

The GLOBAL Technology Awards have recognized the very best new innovations in the printed circuit assembly and packaging industries since 2005. The awards ceremony was held at SMTA International, October 27, 2026 in the Rosemont Exhibition Center, in Rosemont, Illinois, USA.

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