TI Launches Multiprotocol Industrial Networking Devices

Texas Instruments Inc. (TI) has expanded its industrial communication portfolio with two devices designed to simplify connectivity across factory automation, robotics, and industrial IoT (IIoT) systems. The TICS100MOD multiprotocol communications system-on-module (SoM) and TIOM2212 dual-channel IO-Link master provide hardware and software building blocks to connect field devices to industrial networks, reduce development complexity, and support evolving communication standards.

Based on TI's AM2612 microcontroller (MCU) and DP83826AI Ethernet physical layer, the TICS100MOD is described as the industry's smallest fully featured, certified multiprotocol communications module. It supports EtherCAT, EtherNet/IP and PROFINET on a single hardware platform, allowing engineers to switch protocols at boot time through firmware updates rather than redesigning the hardware. The module integrates two Arm Cortex-R5F cores and external memory to run complete protocol stacks and support demanding factory automation applications.

The TIOM2212 extends connectivity to the sensor and actuator level, providing two IO-Link channels to connect field devices with higher-level Industrial Ethernet networks. Its integrated analog functions and protection features support reliable data exchange, while an integrated frame handler enables compatibility with TI's Sitara industrial networking system-on-chips (SoCs) and AM13Ex real-time MCUs. This approach reduces the hardware and design effort required to bridge field devices and factory control systems.

Together, the devices address a key challenge in connected factories: supporting multiple industrial communication protocols without requiring separate hardware implementations for each standard. TI's multiprotocol architecture enables firmware-based protocol switching and customization, helping manufacturers accommodate different customer and regional requirements. Dedicated programmable real-time unit and industrial communication subsystem (PRU-ICSS) hardware in TI MCUs and SoCs handles deterministic, low-latency communication, freeing the general-purpose Arm processors for other system tasks.

TI's broader portfolio includes scalable SoCs with integrated PRU-ICSS, real-time MCUs, protocol-compliant interface devices, and an industrial communication software development kit (SDK). With the TIOM2212, the company now covers the hardware layers of the IO-Link ecosystem, from transceivers and digital output switches to the master device with integrated frame handling. Development resources include certified, production-ready protocol stacks, evaluation modules, application examples, and troubleshooting tools.

TI offers the TIOM2212 in preproduction quantities through TI.com, while the TICS100MOD is scheduled to become available by the end of 2026. TI will demonstrate its multiprotocol technology at electronica 2026, November 10-13, in Munich, Germany, at Hall C4, Booth 159.

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