Texas Instruments Launches Multiprotocol Ethernet Module to Simplify Industrial Connectivity
Texas Instruments (TI) has announced two new devices to improve connectivity across factory automation, robotics and Industrial Internet of Things (IIoT) systems. The new products include a multiprotocol communications system-on-module (SoM) and an IO-Link master. These devices expand TI’s industrial communication portfolio, allowing engineers to use different established industrial communication protocols on a single platform. The solutions combine programmable hardware with certified, ready-to-use software to simplify system integration and support reliable industrial networking.
“Industrial communication is evolving faster than ever, and engineers need a partner who can help them adapt to emerging standards and requirements,” said Karim Jamal, director of Industrial Communications Solutions at TI. “TI brings together certified hardware, software and in-house engineering expertise, supporting customers as they develop next-generation industrial automation systems that work together seamlessly across devices, networks and communication protocols.”
“At SICK, we rely on robust and future-ready communication technologies to connect sensors, machines, and systems. TI’s Industrial Ethernet and IO-Link solutions help us bring products such as the SIG300 to market with the performance and reliability required for modern industrial automation,” said Dr. Stefan Odermatt, senior vice president of research and development, integrated automation at SICK.
Achieve seamless multiprotocol integration
The TICS100MOD is built using TI’s AM2612 microcontroller (MCU) and DP83826AI Ethernet physical layer (PHY). It is a compact, certified communications module that supports multiple real-time Industrial Ethernet protocols on a single piece of hardware. Engineers can switch between EtherCAT, EtherNet/IP and Profinet by updating the firmware during system startup, without changing the hardware. This makes it easier and more cost-effective to adapt industrial equipment to different networking requirements. The module also features two Arm Cortex-R5F processor cores and external memory, providing the computing capacity needed to run industrial communication software and support advanced factory automation applications.
The TIOM2212 dual-channel IO-Link master bridges TI’s upstream multiprotocol approach to the sensor and actuator level with IO-Link connectivity, enabling engineers to connect IO-Link devices to higher-level Industrial Ethernet networks through a single platform. With advanced analog integration and built-in protection features, the TIOM2212 ensures fast, reliable data exchange between field devices. Compatible with TI’s Sitara industrial networking system on-chip (SoC) family and AM13Ex real-time MCUs through an integrated frame handler, the TIOM2212 reduces the design complexity and costs of bridging field devices and factory control systems.
Accelerate innovation in connected factories
Connected factories require multiple industrial communications protocols to exchange data between diverse equipment on the production floor. Supporting multiprotocol networks typically requires separate hardware for each protocol – increasing cost, design complexity and time. Sourcing both hardware and software from a single vendor can simplify integration and customization, reduce supply-chain risk, and streamline long-term platform maintenance.
TI’s multiprotocol portfolio enables engineers to address these design challenges in several ways:
- Protocol flexibility: Firmware-based switching and customization helps meet changing customer or regional requirements without hardware redesign.
- Deterministic communication: Simultaneous real-time performance across multiple protocols, with industry-leading process data cycle times on TI MCUs and processors.
- Software configurability: Full media access control layer access enables highly customized protocol implementations across the stack.
- Streamlined development: Evaluation modules and a software development kit (SDK) with certified, production-ready protocol stacks, application examples, training resources, and development and troubleshooting tools accelerate time to market.
Enable a future ready industrial networking ecosystem with TI technology
Central to TI’s single-chip, multiprotocol approach is the programmable real-time unit and industrial communication subsystem (PRU-ICSS). This proprietary hardware block is integrated into TI MCUs and SoCs to handle deterministic, low-latency industrial communication protocols. By offloading real-time communication to these dedicated cores, the general-purpose Arm CPUs are freed to manage other critical functions, improving overall system performance.
TI’s broader portfolio for industrial communications includes scalable SoCs with an integrated PRU-ICSS, real-time MCUs, protocol-compliant interface devices and an industrial communication SDK. With the addition of the TIOM2212, TI now provides every hardware layer in the IO-Link ecosystem, spanning transceivers, digital output switches and a master device with an integrated frame handler. These solutions are designed, optimized and supported in-house, positioning TI as the partner of choice for networking engineers.
TI at electronica 2026
TI will display its multiprotocol industrial communications technology at electronica, Nov. 10-13, in Munich, Germany. The new TICS100MOD SoM will be featured at TI’s exhibit in Hall C4, booth 159, in two demonstrations:
- TICS100MOD multiprotocol Industrial Ethernet: Reduce complexity and speed up time-to-market by seamlessly integrating multiprotocol industrial Ethernet into any system with TI’s certified, production-ready module.
- New industrial communication technologies and trends: Create a seamless, future-ready industrial networking ecosystem by leveraging the latest Ethernet and IO-Link protocols, integrated neural processing units and time sensitive networking.
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