Chip Industry Technical Paper Roundup: Nov. 3

New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper	Research Organizations
Meter-scale quantum interconnects between large quantum processors	IBM Research
Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI	imec, Vrije Universiteit Brussel
SecDMP: Provably Secure Data Memory-Dependent Prefetching	KU Leuven, EURECOM
APPlace: Co-Optimizing Device Locations and Access Points for Routing-Aware Analog Placement	UT Austin
AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging	Materials Center Leoben, PVA TePla, ASE
Superposed analog memory for vector storage in neural networks	IBM Research Europe

Find more semiconductor research papers here.