SEMI Builds a Global Home for Advanced Packaging

Advanced packaging has a bigger place at SEMICON West than ever, and SEMI is building a global home for the topic through its Advanced Packaging and Heterogeneous Integration (APHI) technology coalition. The effort is led by Beth Keser, who recently joined SEMI as vice president of technology coalitions after more than 30 years in packaging at Motorola, Qualcomm, Intel and two startups.

APHI supports precompetitive technology development, standards and public-private R&D, and SEMI is now bringing APHI Summits to its SEMICON events worldwide, with the goal of making SEMI a place to go for packaging, “and not just front end,” Keser said.

Keser also shared her outlook. Glass core substrates will make an impact sooner than she once expected: “Two years ago I would have said 2030, but because these package sizes are getting so large, I would say 2028.” She expects more bridge-based interconnects as interposer capacity stays tight, a move to 310mm x 310mm panels and eventually larger ones, and a defining focus on lowering energy per bit in the data center.

Click here to read the full article in the SEMICON West Show Daily.

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