Infineon and Wolfspeed Extend SiC Wafer Supply Agreement

Wolfspeed and Infineon Technologies AG have expanded and extended their long-term silicon carbide (SiC) wafer supply agreement to include 200 mm substrates alongside the existing 150 mm wafers. The agreement builds on a supply relationship spanning more than 20 years and strengthens Wolfspeed’s position as a Western supplier of silicon carbide materials.

Adding 200 mm SiC wafers expands the range of substrates available to Infineon for manufacturing silicon carbide power semiconductors. Larger wafer diameters can increase production capacity and improve manufacturing economics, depending on process maturity, yield, and device design. The expanded agreement also provides a framework for supporting demand as SiC power electronics gain adoption across industrial and energy-related applications.

According to the Yole Power SiC 2026 – Markets and Applications report, the global silicon carbide power device market is projected to grow from $3.4 billion in 2024 to $11.1 billion by 2031, representing more than a threefold increase. Key growth areas include electric vehicle (EV) charging infrastructure, renewable energy systems, energy storage, and AI data centers.

SiC is a wide-bandgap semiconductor used in power devices designed for high-voltage, high-efficiency conversion. Compared with conventional silicon-based solutions, SiC power devices can reduce switching losses and support operation at higher temperatures and switching frequencies. These characteristics enable more compact power conversion systems, potentially reducing the size and weight of associated passive components and cooling systems.

Applications include EV charging systems, industrial power supplies, renewable energy inverters, energy storage converters, and power delivery infrastructure for AI data centers. In these systems, improved conversion efficiency can help reduce energy losses and thermal management requirements.

Access to high-quality SiC substrates is key to scaling power semiconductor production. By extending its agreement with Wolfspeed and incorporating 200 mm wafers, Infineon broadens its substrate supply arrangements as demand for SiC-based power solutions increases. The agreement also reinforces the companies’ long-standing commercial relationship and supports the development of manufacturing capacity for the expanding SiC power electronics market.

The post Infineon and Wolfspeed Extend SiC Wafer Supply Agreement appeared first on Power Electronics News.