PC
Infineon Technologies19-PowerSSIP Module, Formed LeadsRoHS

IRAM336-025SB

IC HYBRID 3PH INV 2A 500V SIP-S

IRAM336-025SB by Infineon Technologies
Subcategory

Power Driver Modules

Package

19-PowerSSIP Module, Formed Leads

Series

iMOTION™

Status

Obsolete

Price available on request

MOQ: 1 pcs

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Parameters

ParameterValue
BrandInfineon Technologies
ModelIRAM336-025SB
Package / Case19-PowerSSIP Module, Formed Leads
Mounting TypeThrough Hole
RoHSRoHS
Part StatusObsolete

Application & Notes

IRAM336-025SB by Infineon Technologies is a power conversion IC commonly used in power supply designs, battery-powered devices, and DC-DC conversion modules. Input voltage up to N/A, output adjustable. The 19-PowerSSIP Module, Formed Leads package with surface mount mounting is standard for compact designs. Pay attention to input/output capacitor selection and PCB layout — switching regulators are sensitive to trace inductance.

All Technical Specifications

TypeMOSFET
Current2 A
Voltage500 V
Configuration3 Phase

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